https://am.renesas.com/March 15, 2016Comments Off on Renesas Electronics Delivers New Lineup of Intelligent Power Devices with Low On-Resistance as Replacement for Relays in Automotive Applications to Contribute to Reduced Vehicle Weight
Targeted toward Expanded Adoption in High-Current Load Switch Applications Such as Motor and Heater Control Circuits Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced... Read More
https://www.st.com/web/en/news/n3761March 15, 2016Comments Off on Low-Power Electric Motors Can Now Dissipate Even Less Power with New Intelligent Power Modules from STMicroelectronics
STMicroelectronics has expanded its Intelligent Power Module portfolio with the introduction of the SLLIMM™[1] -nano 2nd series, adding higher power levels and new package options that are especially suited to... Read More
https://news.samsung.com/March 15, 2016Comments Off on Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology Based on Chip-Scale Packaging Technology
Samsung Electronics, a world leader in advanced component solutions, introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer)... Read More
https://www.mediatek.com/March 15, 2016Comments Off on MediaTek Launches Imagiq™ Image Signal Processor
MediaTek Launches Imagiq™ Image Signal Processor, Accelerating the Smartphone Multimedia Revolution Dual camera support, high-definition images and video features offer uncompromising mobile photography experience MediaTek today announced the ImagiqTMimage signal... Read More
press.xilinx.comMarch 14, 2016Comments Off on Xilinx Demonstrates 56G PAM4 Transceiver Technology
Xilinx, Inc. announced it has developed a 16nm FinFET+-based programmable device running 56G transceiver technology using the 4-level Pulse Amplitude Modulation (PAM4) transmission scheme. Recognized by the industry as the... Read More
https://news.panasonic.com/March 14, 2016Comments Off on Panasonic Power Devices on Display at the “Applied Power Electronics Conference and Exposition 2016” in the USA
Panasonic Corporation will exhibit its power device products at the Applied Power Electronics Conference and Exposition 2016 (APEC 2016) over a period of 5 days, from March 20 to 24,... Read More
www.mentor.comMarch 14, 2016Comments Off on Mentor Graphics Optimizes Tools and Flows to Help Designers Succeed With Samsung Foundry’s 10nm FinFET Process
Mentor Graphics Corporation (NASDAQ: MENT) today announced that, in collaboration with Samsung Electronics, it is delivering a wide range of design, verification and test tools and flows optimized for Samsung... Read More
https://news.samsung.com/March 14, 2016Comments Off on Samsung Adds Advanced Color Quality Features to its Small LES, Chip-on-Board LED Solutions for Premium Commercial LED Lighting
Samsung Electronics, a world leader in advanced component solutions, introduced new color quality improvements for its small LES* (light-emitting surface) chip-on-board (COB**) package LC series: LC010, LC020 and LC040. The... Read More
https://www.st.com/web/en/press/p3802March 13, 2016Comments Off on Free Software Tool from STMicroelectronics Adds One More Reason to Choose STM8 Microcontrollers for Small, Smart Devices
New Cosmic CXSTM8 C-compiler completes free and unlimited development toolchain Highly featured compiler supports entire STM8 family up to 128KB, with no restrictions on code size Design-start investment cut to... Read More
https://www.infineon.com/March 13, 2016Comments Off on CoolMOS™ CE in SOT-223 package as cost-effective drop-in replacement for DPAK
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is growing the portfolio of CoolMOS™ CE with a SOT-223 package. For Infineon’s CoolMOS, this package offers a cost effective alternative to... Read More