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Beyond Copper: Why Integrated Photonics Is Key to Scaling AI Infrastructure
Engineering AI: Why Physical AI Is Becoming an Industrial Foundation
Cellular from Space: The RF Challenge Behind Direct-to-Device Connectivity
IBM Quantum Computer Accurately Simulates Real Magnetic Materials, Reproducing National Laboratory Data
Arrow Electronics Announces New Single Pair Ethernet Reference Design Featuring Bourns, Microchip and Amphenol Technology
Siemens introduces AI-powered on-premises analytics for industrial drivetrain systems
Menlo Micro Achieves Key Milestone in U.S. Navy Advanced Circuit Breaker Program, Validating Scalable MEMS Power Switching Leadership
Wireless modules for embedded systems now available from Tria Technologies
Tower Semiconductor and Coherent Demonstrate 400Gbps/lane Data Transmission with a Silicon Modulator in a Production-Ready Sipho Process
Power Integrations Extends Flyback Topology to Enable 440 W, Offering Simpler Alternatives to Resonant Power Designs

New Intel Core X-Series Processors: Scale, Accessibility and Performance Go Extreme

https://newsroom.intel.com May 30, 2017 Comments Off

More Data Requires More Power; Intel Introduces New 4-18 Core SKUs, Intel Core i9 and its First Teraflop Desktop CPUs As I take the stage in Taipei today at Computex,... Read More

Analog Devices’ Small Isolated Gate Drivers Deliver Solutions for Next Generation Power Switch Technology

www.analog.com May 24, 2017 Comments Off

Anlog Devices, Inc. (ADI) today announced small form factor isolated gate drivers designed for the higher switching speeds and system size constraints required by power switch technologies such as SiC... Read More

Harwin extends 1.25mm micro signal high-reliability connector range

www.harwin.com May 24, 2017 Comments Off

Following strong customer uptake of its initial release of the high-reliability Gecko Screw-Lok 1.25mm pitch connector, Harwin has now doubled the range, with four new pin count sizes complementing the... Read More

Ultra-Wideband 3GHz to 20GHz Mixer with Integrated LO Buffer Offers 23.9dBm IIP3 in a Tiny 3mm x 2mm Package

May 24, 2017 Comments Off

MILPITAS, CA & NORWOOD, MA – May 23, 2017 – Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTC5553, a double balanced mixer providing best-in-class matched bandwidth... Read More

TI introduces the industry’s smallest gate driver and power MOSFET solution for motor control

newscenter.ti.com May 23, 2017 Comments Off

TI introduces the industry’s smallest gate driver and power MOSFET solution for motor control – May 23, 2017 Texas Instruments (TI) (NASDAQ:TXN) today introduced two new device families that help... Read More

TI unveils the world’s most precise single-chip millimeter wave sensor portfolio available today

newscenter.ti.com May 22, 2017 Comments Off

Texas Instruments (TI) (NASDAQ: TXN) is bringing an unprecedented degree of precision and intelligence to a range of applications spanning the automotive, factory and building automation, and medical markets. TI’s... Read More

Teledyne e2v delivers first space-grade commercial processors to Thales Alenia Space for use in a European satellite mission

www.e2v.com May 22, 2017 Comments Off

Teledyne e2v has set a European mission first by re-engineering commercial microprocessors that provide Thales Alenia Space with a major increase in processing speed and power for lightning imaging satellites’... Read More

Microchip’s Wi-Fi® SDK with Apple HomeKit Support Now Available

www.microchip.com May 22, 2017 Comments Off

A fully-certified Wi-Fi® Software Development Kit (SDK) with Apple HomeKit support is now available from Microchip Technology Inc. (NASDAQ: MCHP). This SDK enables MFi licensees to create fast, low-power designs... Read More

Tektronix Raises the Standard for Isolated Measurements Tektronix Enhances its IsoVu Portfolio by Offering Products with a Large Differential Voltage Range and High Input Impedance

news.tektronix.com May 21, 2017 Comments Off

Tektronix, a leading worldwide provider of measurement solutions, is extending its leadership in isolated measurement systems. In 2016, Tektronix set a new standard for power measurements by introducing IsoVu, a... Read More

Xilinx Announces Integration of 56G PAM4 Transceiver Technology into its Virtex UltraScale+ FPGAs

www.xilinx.com May 18, 2017 Comments Off

Today announced integration of 56G PAM4 transceiver technology into its industry-leading Virtex® UltraScale+™ FPGAs. Built upon proven 16nm FinFET+ FPGA fabric, these devices will expand the Virtex product line to... Read More

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