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Beyond Copper: Why Integrated Photonics Is Key to Scaling AI Infrastructure
Engineering AI: Why Physical AI Is Becoming an Industrial Foundation
Cellular from Space: The RF Challenge Behind Direct-to-Device Connectivity
IBM Quantum Computer Accurately Simulates Real Magnetic Materials, Reproducing National Laboratory Data
Arrow Electronics Announces New Single Pair Ethernet Reference Design Featuring Bourns, Microchip and Amphenol Technology
Siemens introduces AI-powered on-premises analytics for industrial drivetrain systems
Menlo Micro Achieves Key Milestone in U.S. Navy Advanced Circuit Breaker Program, Validating Scalable MEMS Power Switching Leadership
Wireless modules for embedded systems now available from Tria Technologies
Tower Semiconductor and Coherent Demonstrate 400Gbps/lane Data Transmission with a Silicon Modulator in a Production-Ready Sipho Process
Power Integrations Extends Flyback Topology to Enable 440 W, Offering Simpler Alternatives to Resonant Power Designs

Latest PIC32 family increases performance while reducing power consumption

June 21, 2017 Comments Off

Microchip announces a new family of eXtreme Low Power (XLP) technology 32-bit microcontrollers (MCUs). The PIC32MX1/2 XLP family offers current PIC32MX customers an easy migration path to achieve higher performance... Read More

Broadcom Delivers High Performance Data Plane Programmability with new Trident 3 Generation of 10/25/100G Ethernet Switches

www.broadcom.com June 18, 2017 Comments Off

Broadcom Limited (NASDAQ:AVGO), today announced immediate availability of the first members of its breakthrough Trident 3 family of programmable switches for data center, enterprise, and service provider networks transitioning to high density 10/25/100G... Read More

60V Low IQ Synchronous Step-Down Controller Operates at Up to 2.25MHz for High Power Density

June 16, 2017 Comments Off

Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTC7800, a synchronous step-down DC/DC controller that operates at up to 2.25MHz for reduced circuit size and increased power... Read More

Five new MIL-COTS parts help simplify designs and optimize SWaP-C attributes

June 15, 2017 Comments Off

The VIA DCM family are ruggedized modular DC-DC converters in a thermally adept, low profile (9.3 mm) VIA package, with wide input voltage range specifications and isolated, regulated high efficiency... Read More

Wireless Gecko SoC Portfolio Supports Full Bluetooth 5 Connectivity and Expands Memory Options

June 14, 2017 Comments Off

Silicon Labs (NASDAQ: SLAB) expands its Wireless Gecko system-on-chip (SoC) portfolio with new multiband SoCs supporting full Bluetooth® 5 connectivity and more memory options. Silicon Labs’ new EFR32xG13 SoCs offer... Read More

Microchip extends eXtreme Low Power PIC32MM microcontroller family

June 14, 2017 Comments Off

Microchip announces new PIC32MM “GPM” microcontrollers (MCUs). These eXtreme Low Power (XLP) MCUs feature large memory in small packages to provide ample battery life for space-constrained applications. With the inclusion... Read More

Maxim’s Automotive LED Controller Eliminates Trade-Off Between Fast Response Time and Low EMI for Exterior Lighting and Improved Safety Applications

June 14, 2017 Comments Off

The MAX20078 synchronous buck, high-brightness LED controller from Maxim Integrated Products, Inc. (NASDAQ: MXIM) is the only product available which provides both fast response time and low electromagnetic interference (EMI)... Read More

New Line of Compact, Encapsulated Ac-Dc Power Supplies Ranging From 6 W to 20 W

June 14, 2017 Comments Off

CUI’s Power Group today introduced a new line of low power, encapsulated ac-dc power supplies ( https://www.cui.com/encapsulated-ac-dc-power-supplies ) to their broad power portfolio ranging from 1 W to 12 kW.... Read More

TE Connectivity Introduces D-3000 First Mate Last Break Dynamic Series Connector

June 14, 2017 Comments Off

TE Connectivity (TE), a world leader in connectivity and sensors, is unveiling a new addition to its Dynamic Series of First Mate Last Break (FMLB) connectors. The D-3000 FMLB 5.08mm... Read More

Maxim’s Dual IO-Link® Master Transceiver Ensures Robust Communications with 50% Lower Power for Industry 4.0 Applications

June 14, 2017 Comments Off

Designers of Industry 4.0 applications can now achieve robust communications and reduce power dissipation by 50% with the MAX14819 dual-channel, IO-Link master transceiver from Maxim Integrated Products, Inc. (NASDAQ: MXIM).... Read More

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