Anritsu Delivers Higher Line Productivity and Lower Costs with World’s First Fully Automatic Testing for IEEE802.11ax Devices

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Anritsu Corporation has announced the release of three new software packages to expand the measurement standards supported by the Universal Wireless Test Set MT8870A, enabling fast and fully automatic testing... Read More

Curtiss-Wright Announces Its First VITA 48.8 Air-Flow-Through (AFT) 3U VPX 6Gsps Wideband Transceiver FPGA Card

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NEW XILINX® ULTRASCALE+™ BASED VPX3-535 (AND ULTRASCALE™ BASED VPX3-534 CONDUCTION COOLED VARIANT) FEATURE FPGAS TO DELIVER 2X THE PERFORMANCE FOR C4ISR APPLICATIONS ASHBURN, Va. – January 26, 2018 — Curtiss-Wright’s Defense... Read More

ST Technologies Help Neonode Add Touch Interaction to Any Object, Surface, or Space

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State-of-the-art silicon chips from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, have enabled new zForce AIR™ touch-sensing modules from Neonode (NASDAQ: NEON),... Read More

Molex Spotlights High-Speed Data Connectivity and Expertise at DesignCon 2018

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 Molex, a global provider of integrated electronic products, will showcase high-speed data connectivity solutions at DesignCon 2018 in Santa Clara, CA, January 31-February 1, 2018. Molex, booth 633, will feature... Read More

One for all: the embedded motherboard that suits all high-end applications

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congatec presents high-end Mini-ITX motherboard that scales across all processor sockets congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services... Read More

New Buck-Boost Converter from ROHM Provides 1.3x Longer Battery Life

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Class-leading current consumption prolongs battery life in battery powered applications ROHM has recently announced the development of a buck-boost DC/DC converter with built-in MOSFET featuring the lowest current consumption in... Read More