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KEMET Announces New Automotive Grade Film Capacitors for Use in the Most Challenging Environments

February 8, 2018 Comments Off on KEMET Announces New Automotive Grade Film Capacitors for Use in the Most Challenging Environments

KEMET, a leading global supplier of electronic components, today announced a new family of automotive grade metallized polypropylene film capacitors. F863 class X2 miniature capacitors are specifically designed to provide robust performance in safety applications... Read More

Anritsu Delivers Higher Line Productivity and Lower Costs with World’s First Fully Automatic Testing for IEEE802.11ax Devices

February 5, 2018 Comments Off on Anritsu Delivers Higher Line Productivity and Lower Costs with World’s First Fully Automatic Testing for IEEE802.11ax Devices

Anritsu Corporation has announced the release of three new software packages to expand the measurement standards supported by the Universal Wireless Test Set MT8870A, enabling fast and fully automatic testing... Read More

Curtiss-Wright Announces Its First VITA 48.8 Air-Flow-Through (AFT) 3U VPX 6Gsps Wideband Transceiver FPGA Card

https://www.curtisswrightds.com/ February 4, 2018 Comments Off on Curtiss-Wright Announces Its First VITA 48.8 Air-Flow-Through (AFT) 3U VPX 6Gsps Wideband Transceiver FPGA Card

NEW XILINX® ULTRASCALE+™ BASED VPX3-535 (AND ULTRASCALE™ BASED VPX3-534 CONDUCTION COOLED VARIANT) FEATURE FPGAS TO DELIVER 2X THE PERFORMANCE FOR C4ISR APPLICATIONS ASHBURN, Va. – January 26, 2018 — Curtiss-Wright’s Defense... Read More

ST Technologies Help Neonode Add Touch Interaction to Any Object, Surface, or Space

https://www.st.com February 4, 2018 Comments Off on ST Technologies Help Neonode Add Touch Interaction to Any Object, Surface, or Space

State-of-the-art silicon chips from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, have enabled new zForce AIR™ touch-sensing modules from Neonode (NASDAQ: NEON),... Read More

Molex Spotlights High-Speed Data Connectivity and Expertise at DesignCon 2018

www.molex.com February 4, 2018 Comments Off on Molex Spotlights High-Speed Data Connectivity and Expertise at DesignCon 2018

 Molex, a global provider of integrated electronic products, will showcase high-speed data connectivity solutions at DesignCon 2018 in Santa Clara, CA, January 31-February 1, 2018. Molex, booth 633, will feature... Read More

One for all: the embedded motherboard that suits all high-end applications

February 1, 2018 Comments Off on One for all: the embedded motherboard that suits all high-end applications

congatec presents high-end Mini-ITX motherboard that scales across all processor sockets congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services... Read More