March 16, 2018Comments Off on RS Components introduces new flush-mount pushbuttons for modern control panel design
RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, has announced availability of more than 150 new lines of flush-mount pushbuttons from the Harmony... Read More
March 16, 2018Comments Off on u-blox announces smallest industrial Bluetooth 5 module
Ultra-compact and designed for tough environments, ANNA-B1 is fully tailored to applications for the Industrial Internet of Things. Thalwil, Switzerland – March 13, 2018 – u-blox (SIX:UBXN), a global leader... Read More
https://www.onsemi.comMarch 16, 2018Comments Off on X-Class CMOS Image Sensor Platform from ON Semiconductor Enables New Functionality for Industrial Camera Design
ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has announced its X-Class image sensor platform, which allows a single camera design to support not only multiple product resolutions but also... Read More
March 16, 2018Comments Off on Insights from Farnell element14 customers confirm why the Raspberry Pi is increasingly being adopted for professional use
Farnell element14, the Development Distributor, shares insight from customers using the Raspberry Pi on the launch of the new Raspberry Pi 3 Model B+. Feedback from customers demonstrates growing adoption... Read More
March 14, 2018Comments Off on Rohde & Schwarz to present compact amplifier for latest-generation satellite uplinks
The R&S PKU100 from Rohde & Schwarz ushers in a true technology shift in uplink signal amplification. The device uses solid-state output stages throughout and offers a genuine alternative to... Read More
March 14, 2018Comments Off on Samsung Enhances Chip-Scale LED Package Lineup with Industry’s Highest Luminous Efficacies
Samsung Electronics, a world leader in advanced digital component solutions, today announced that it has achieved the industry’s highest light efficacies for its fillet-enhanced chip-scale package (FEC) LED lineup –... Read More
March 14, 2018Comments Off on Vicor’s Power-on-Package System Provides up to 1,000A Peak Current
Vicor Corporation (NASDAQ: VICR) today announced a new Power-on-Package (“PoP”) ChiP-set including Modular Current Multipliers (“MCMs”) for high performance GPU, CPU, and ASIC (“XPU”) processors. PoP MCMs multiply current and... Read More
www.e2v.comMarch 9, 2018Comments Off on Teledyne e2v, pSemi and GaN Systems Unveil Industry’s Fastest Hi-Rel GaN Power Solution at Satellite 2018
Teledyne e2v is launching a complete GaN power solution based on technology from pSemi (formerly Peregrine Semiconductor) and GaN Systems. The solution features GaN FETs and the industry’s first rad-tolerant,... Read More
March 9, 2018Comments Off on Anritsu Announces Signal Analyzer MS2850A Selected by Samsung for 5G system development
Anritsu Corporation announces Samsung Electronics Co., Ltd. selected its Signal Analyzer MS2850A with 5G analysis software installed to support 5G system developments. Samsung unveiled its end-to-end 5G product portfolios including... Read More
https://www.st.comMarch 8, 2018Comments Off on New ACEPACK™ Power Modules from STMicroelectronics Deliver Advanced Performance and Economy
STMicroelectronics’ new ACEPACK™ (Adaptable Compact Easier PACKage) modules provide cost-effective and highly integrated power conversion for 3-30 kW applications including industrial motor drives, air conditioners, solar generators, welders, battery chargers, UPS... Read More