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Toshiba launches 1.5A LDO regulators in ultra-small package

March 23, 2018 Comments Off

Toshiba Electronics Europe has started shipping a new low-dropout (LDO) regulator series in the industry’s smallest WCSP6F package measuring just 1.2mm x 0.8mm x 0.3mm. The TCR15AG series comprises of... Read More

WE-KI HC and WE-CAIR Inductive Component Series in Simulation

March 22, 2018 Comments Off

As part of their Microwave Global Models™ cooperation, Würth Elektronik eiSos and Modelithics make two more Würth Elektronik eiSos product series available. This means that developers can simulate the high... Read More

Samsung Enables Premium Multimedia Features in High-End Smartphones with Exynos 7 Series 9610

March 22, 2018 Comments Off

Samsung Electronics, a world leader in advanced semiconductor technology, today announced the availability of its latest application processor (AP), the Exynos 7 Series 9610. The Exynos 9610, built on Samsung’s... Read More

Maxim’s Himalaya uSLIC Solution, the Industry’s Smallest Power Modules, Revolutionizes Design for Highly Space-Constrained Applications

March 22, 2018 Comments Off

Designers working on space-constrained applications can now dramatically reduce solution size and increase efficiency with the family of micro system-level IC (“uSLIC”) modules from Maxim Integrated Products, Inc. (NASDAQ: MXIM).... Read More

ROHM announces Industry’s First Power Supply ICs for Hi-Fi Audio

March 20, 2018 Comments Off

ROHM announces Industry’s First Power Supply ICs for Hi-Fi Audio Improves audio quality from power supply lines by combining proprietary analog and sound reproduction technologies In recent years, the popularization... Read More

congatec simplifies integration of smart vision at transportation checkpoints

March 20, 2018 Comments Off

Deggendorf, Germany, 20 March 2018 * * * congatec – a leading vendor of standardized and customized embedded computer boards and modules – introduces its first embedded x86-based MIPI-CSI 2 Kit... Read More

Huawei Ground Breaking NB-IoT Chipsets now Supported by Anritsu Wireless Test Solution

March 20, 2018 Comments Off

Universal Wireless Test Set MT8870A provides Huawei with improved product quality and manufacturing efficiencies Luton, United Kingdom – March 20, 2018 – Anritsu Corporation is pleased to announce that Huawei... Read More

Toshiba Launches Photocoupler with UVLO Function for Digitally Controlled Switching Power Supplies and IPM Drives

March 20, 2018 Comments Off

Toshiba Electronics Europe today announced the launch of a new high-speed IC-Photocoupler for MOSFET gate signal insulation. The TLP2735 is Toshiba’s first photocoupler to incorporate an under voltage lockout (UVLO)... Read More

Flex Power Modules announces new highly efficient small-footprint DC/DC converter

March 16, 2018 Comments Off

Flex Power Modules today announced a new one-sixteenth-brick 12V-output DC/DC converter module that can deliver 200 watts of power and has industry-leading efficiency of up to 95%, making it ideal... Read More

Compact Power Measurement Tool for IoT Applications from Qoitech Now in Stock at Digi-Key

March 16, 2018 Comments Off

Qoitech AB today announces that it has signed a worldwide distribution agreement with Digi-Key Electronics, a global electronic components distributor, to distribute the Otii solution, a power measurement tool with... Read More

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