Double DPAK: first top-side cooled SMD solution for high power applications

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Increasing complexity of end products is challenging the design parameters for high power supplies: these require higher power and more efficiency in an even smaller space. Semiconductor devices are essential to... Read More

Cypress Unveils the World’s Most Advanced Flash Memory Solutions for Developers of Safety-Critical Applications in Automotive and Industrial Cypress Unveils the World’s Most Advanced Flash Memory Solutions for Developers of Safety-Critical Applications in Automotive and Industrial

Comments Off on Cypress Unveils the World’s Most Advanced Flash Memory Solutions for Developers of Safety-Critical Applications in Automotive and Industrial Cypress Unveils the World’s Most Advanced Flash Memory Solutions for Developers of Safety-Critical Applications in Automotive and Industrial

Semper™ Flash Family Combines Superior Performance with Industry-leading Functional Safety and Reliability SAN JOSE, Calif., May 30, 2018 – Cypress Semiconductor Corp. (Nasdaq: CY), the embedded solutions leader, today announced its... Read More

From vehicles to the factory, TI mmWave sensors create a smarter world

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TI delivers the industry’s first and only single-chip, CMOS millimeter-wave sensor in mass production DALLAS, May 30, 2018 /PRNewswire/ — One year after introducing the world’s most precise millimeter wave (mmWave)... Read More

Cadence Debuts Industry’s First Analog IC Design-for-Reliability Solution

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Addresses reliability challenges across the product lifecycle for automotive, medical, industrial, aerospace and defense applications Cadence has introduced the Cadence® Legato™ Reliability Solution, the industry’s first software product that meets... Read More

Analog Devices’ Low-Power, Single-Channel 16-Bit DAC Enables High Density Analog Output Modules without De-Rating

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Analog Devices, Inc. (ADI) today introduced the AD5758 digital-to-analog converter (DAC). It incorporates the company’s second-generation Dynamic Power Control (DPC) to enable high density AOUT modules without requiring de-rating—the need to... Read More