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Toshiba Develops DNN Hardware IP for Image Recognition AI Processor ViscontiTM5 for Automotive Driver Assistance Systems

January 7, 2019 Comments Off on Toshiba Develops DNN Hardware IP for Image Recognition AI Processor ViscontiTM5 for Automotive Driver Assistance Systems

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today announced the development of Deep Neural Network (DNN [1]) hardware IP[2] that will help to realize advanced driver assistance systems (ADAS) and... Read More

ams to ease implementation of 3D optical sensing technology through partnership with software specialist Face++

ams.com January 7, 2019 Comments Off on ams to ease implementation of 3D optical sensing technology through partnership with software specialist Face++

ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, and Face++ (www.megvii.com), the leader in artificial intelligence software, have agreed a co-operation arrangement to accelerate OEMs’ and... Read More

STMicroelectronics Drives AI to Edge and Node Embedded Devices with STM32 Neural-Network Developer Toolbox

www.st.com January 7, 2019 Comments Off on STMicroelectronics Drives AI to Edge and Node Embedded Devices with STM32 Neural-Network Developer Toolbox

Leveraging the industry-leading position of its STM32 family of microcontrollers, STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has extended the associated STM32CubeMX ecosystem for... Read More

AVX INTRODUCES NEW ULTRAMINIATURE, THIN-FILM TRANSMISSION LINE CAPACITORS FOR HIGH-PERFORMANCE MICROWAVE & RF APPLICATIONS

January 3, 2019 Comments Off on AVX INTRODUCES NEW ULTRAMINIATURE, THIN-FILM TRANSMISSION LINE CAPACITORS FOR HIGH-PERFORMANCE MICROWAVE & RF APPLICATIONS

AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, introduced a new line of ultraminiature, thin-film transmission line capacitors for high-frequency... Read More

Four-in-one environmental sensor, available from RS Components, saves space and power in portables, wearables, and IoT devices

December 30, 2018 Comments Off on Four-in-one environmental sensor, available from RS Components, saves space and power in portables, wearables, and IoT devices

RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), a global multi-channel distributor, is stocking the Bosch Sensortec BME680 four-in-one environmental sensor and associated shuttle board that simplifies product... Read More

Industry’s first RISC-V SoC FPGA architecture brings real-time to Linux, giving developers the freedom to innovate in low-power, secure and reliable designs

December 20, 2018 Comments Off on Industry’s first RISC-V SoC FPGA architecture brings real-time to Linux, giving developers the freedom to innovate in low-power, secure and reliable designs

Microchip, via its Microsemi Corporation subsidiary, announces an extension to its Mi-V ecosystem by unveiling the architecture for a new class of SoC FPGAs at the RISC-V Summit, Dec. 4... Read More

Osram enters the 3D sensing market with two new VCSELs

www.osram-group.com December 19, 2018 Comments Off on Osram enters the 3D sensing market with two new VCSELs

VCSELs combine the high power density and simple packaging of an IRED with the spectral width and speed of a laser. Unlike laser diodes, VCSELs and are much less sensitive... Read More