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Toshiba starts sample shipments of automotive DC motor driver IC with LIN slave function

March 5, 2019 Comments Off

Toshiba Electronics Europe GmbH has started sample shipments of an automotive DC motor driver IC with a LIN (Local Interconnect Network) slave function that can communicate with a LIN 2.0... Read More

New ams light sensor with 50/60Hz flicker detect helps mobile phones take great photos every time

ams.com March 4, 2019 Comments Off

ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today introduces a new color (RGB), proximity and flicker detection sensor, the TCS3707, which enables a mobile phone camera... Read More

Toshiba Memory Europe Adds BiCS FLASH To Lineup of e-MMC Ver. 5.1 Compliant Embedded Flash Memory Products

March 1, 2019 Comments Off

Toshiba Memory Europe GmbH today announced a range of four new JEDEC e-MMC (Embedded MultiMediaCard) Ver. 5.1 compliant embedded flash memory products for consumer applications. The new products integrate Toshiba... Read More

Dialog Semiconductor’s Latest Family of Bluetooth Low Energy Wireless Multi-core MCUs, sets the Standard for Tomorrow’s Users

February 27, 2019 Comments Off

Dialog Semiconductor plc (XETRA:DLG), a provider of custom and configurable power management, AC/DC power conversion, charging and Bluetooth® low energy technology, today unveiled the SmartBond™ DA1469x family of Bluetooth low... Read More

New fully integrated embedded motor controller with extended memory for automotive applications

www.micronas.com February 27, 2019 Comments Off

TDK Corporation (TSE 6762) expands its Micronas embedded motor controller portfolio with the HVC 4420F, featuring extended flash memory for the drive of small brush-type, stepper, or brushless motors. It... Read More

Cypress USB-C with Power Delivery Making Universal Power Adapters a Reality

February 27, 2019 Comments Off

Cypress Semiconductor Corp. (NASDAQ: CY), the embedded solutions leader, today introduced a USB-C Power Delivery (PD) solution designed to reduce the e-waste resulting from the estimated one million tons of... Read More

REAL3™ Time-of-Flight image sensor: fourth generation with HVGA resolution for high quality photo effects and more

February 27, 2019 Comments Off

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is presenting the fourth generation of its REAL3™ image sensor IRS2771C at Mobile World Congress 2019 in Barcelona, Spain. The 3D Time-of-Flight... Read More

Industry’s first automotive USB 3.1 SmartHub with Type-C™ support enables 10x faster data rates in infotainment systems

February 26, 2019 Comments Off

Microchip announces an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB 2.0 solutions and reducing indexing times to improve the user... Read More

Joint Demonstration of Anritsu 5G Tester with TCL Communication 5G USB Device at MWC2019

February 26, 2019 Comments Off

Anritsu today announced it will jointly demonstrate its MT8000A 5G tester with TCL Communication’s first 5G USB device at Mobile World Congress 2019. The TCL Communication 5G USB device is... Read More

Toshiba Image Recognition SoC for Automotive Applications Integrates a Deep Neural Network Accelerator

February 26, 2019 Comments Off

Toshiba Electronics Europe GmbH (TEE) today announced development of an image recognition SoC (System on Chip) for automotive applications that implements deep learning accelerator at 10 times the speed and... Read More

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