NEW PRODUCTS | Page 113 of 315

Infineon announces new microcontroller optimized for automotive 77 GHz radar applications

October 15, 2019 Comments Off

Munich, Germany – 15 October 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will add a new member to its automotive microcontroller family AURIX™. TC3A will address new... Read More

Optimized Cybersecurity in the Vehicle Through Flexible HSM Software

October 10, 2019 Comments Off

Stuttgart, GERMANY, 2019-10-08 – To increase cybersecurity in vehicles, vHSM from Vector Informatik is now available. It is a software stack for hardware security modules that contains a wide variety... Read More

Adaptec® Smart Storage offering is first to include open source toolkit for managing data center storage

October 10, 2019 Comments Off

Public and private cloud infrastructure suppliers are turning to open-source tools to simplify the configuration, deployment and management of their server storage platforms. Until now, companies were faced with the... Read More

Würth Elektronik offers grounding cable clips WE-EEL

October 10, 2019 Comments Off

Low-resistance grounding of the cable shield Waldenburg (Germany), 10 October 2019 – Under the product name WE-EEL, Würth Elektronik now offers cable clips made of aluminum sheet to enable stable... Read More

ON Semiconductor’s XGS Family includes new high resolution Imagers with HiSPi Interface

New-Tech Europe Magazine October 10, 2019 Comments Off

ON Semiconductor has expanded its high-performance XGS family of Global Shutter CMOS image sensors with two new models; the XGS 9400 and the XGS 8000. These devices provide resolutions of... Read More

Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging Technology

https://news.samsung.com October 10, 2019 Comments Off

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed the industry’s first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung’s new innovation is considered one... Read More

Digi-Key Electronics Launches Partnership with Analog Devices on Innovative MeasureWare Platform

New-Tech Europe Magazine October 10, 2019 Comments Off

THIEF RIVER FALLS, Minnesota, USA – Digi-Key Electronics, the global electronic components distributor, announced today a partnership with Analog Devices on their innovative new MeasureWare platform. The multi-sensor platform will... Read More

CML removes barriers to wider use of AIS, increasing maritime safety for more sea vessels

New-Tech Europe Magazine October 10, 2019 Comments Off

Maldon, Essex – 9 October 2019 – CML Microcircuits is pleased to introduce the SCT7033, the industry’s first AIS Class B processor to include the full protocol stack already embedded... Read More

Vicor introduces a new lower-power DCM2322 family of isolated, regulated DC-DC modules

October 10, 2019 Comments Off

Power density, low weight and ease-of-use are critical considerations when designing isolated, regulated DC-DC converter systems for a broad range of robotics, UAV, rail, communications and defense/aerospace applications. The new... Read More

Rohde & Schwarz and MESIT jointly invest in secure communications solutions and form DICOM

www.rohde-schwarz.com October 7, 2019 Comments Off

Rohde & Schwarz and MESIT have established a new joint venture (JV) with MESIT as the majority shareholder. The strategic purpose is to further enhance the trusted, interoperable SOVERON communications system. SOVERON stands... Read More

« First ‹ Previous 111 112113114 115 Next ›Last »