October 15, 2019Comments Off on Infineon announces new microcontroller optimized for automotive 77 GHz radar applications
Munich, Germany – 15 October 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will add a new member to its automotive microcontroller family AURIX™. TC3A will address new... Read More
October 10, 2019Comments Off on Optimized Cybersecurity in the Vehicle Through Flexible HSM Software
Stuttgart, GERMANY, 2019-10-08 – To increase cybersecurity in vehicles, vHSM from Vector Informatik is now available. It is a software stack for hardware security modules that contains a wide variety... Read More
October 10, 2019Comments Off on Adaptec® Smart Storage offering is first to include open source toolkit for managing data center storage
Public and private cloud infrastructure suppliers are turning to open-source tools to simplify the configuration, deployment and management of their server storage platforms. Until now, companies were faced with the... Read More
October 10, 2019Comments Off on Würth Elektronik offers grounding cable clips WE-EEL
Low-resistance grounding of the cable shield Waldenburg (Germany), 10 October 2019 – Under the product name WE-EEL, Würth Elektronik now offers cable clips made of aluminum sheet to enable stable... Read More
New-Tech Europe MagazineOctober 10, 2019Comments Off on ON Semiconductor’s XGS Family includes new high resolution Imagers with HiSPi Interface
ON Semiconductor has expanded its high-performance XGS family of Global Shutter CMOS image sensors with two new models; the XGS 9400 and the XGS 8000. These devices provide resolutions of... Read More
https://news.samsung.comOctober 10, 2019Comments Off on Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging Technology
Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed the industry’s first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung’s new innovation is considered one... Read More
New-Tech Europe MagazineOctober 10, 2019Comments Off on Digi-Key Electronics Launches Partnership with Analog Devices on Innovative MeasureWare Platform
THIEF RIVER FALLS, Minnesota, USA – Digi-Key Electronics, the global electronic components distributor, announced today a partnership with Analog Devices on their innovative new MeasureWare platform. The multi-sensor platform will... Read More
New-Tech Europe MagazineOctober 10, 2019Comments Off on CML removes barriers to wider use of AIS, increasing maritime safety for more sea vessels
Maldon, Essex – 9 October 2019 – CML Microcircuits is pleased to introduce the SCT7033, the industry’s first AIS Class B processor to include the full protocol stack already embedded... Read More
October 10, 2019Comments Off on Vicor introduces a new lower-power DCM2322 family of isolated, regulated DC-DC modules
Power density, low weight and ease-of-use are critical considerations when designing isolated, regulated DC-DC converter systems for a broad range of robotics, UAV, rail, communications and defense/aerospace applications. The new... Read More
www.rohde-schwarz.comOctober 7, 2019Comments Off on Rohde & Schwarz and MESIT jointly invest in secure communications solutions and form DICOM
Rohde & Schwarz and MESIT have established a new joint venture (JV) with MESIT as the majority shareholder. The strategic purpose is to further enhance the trusted, interoperable SOVERON communications system. SOVERON stands... Read More