Connectors & Cables

New Line of USB 2.0 and 3.0 Connectors Expands CUI’s Interconnect Portfolio

TUALATIN, Ore. — October 18, 2016 — CUI’s Components Group today announced an expansion to its existing portfolio of power, audio and…

10 years ago

Amphenol Aerospace High Speed Solutions Introduces Rugged VPX Media & Protocol Conversion Modules

Sidney, N.Y. June 2016 – Amphenol Aerospace, a global leader in interconnect technologies, now offers an off-the-shelf protocol/media converter VPX…

10 years ago

Cypress USB-C Power Delivery Solution Helps LeEco Debut the World’s First Smartphones with One Port for Data Transmission, Power Charging and Audio

Cypress EZ-PD™ CCG2 Controller Enables Le Max2 Superphone and Charger to Bring Consumers the Fast Charging of the USB Power…

10 years ago

Panasonic Develops Two Types of Connectors for Connecting In-vehicle LED Lamp Modules to Boards

Panasonic will start delivering samples of its new "Board to FPC" and "Board to Wire" connectors in June 2016. Osaka,…

10 years ago

Amphenol Industrial’s Max-M12 Expansion

The Amphenol Industrial Products Group has enhanced its Max M12 product line to include board level connectors that mate to…

10 years ago

Hi-Rel industries shift to jackscrew fixings for ultimate connection security

Robotics, Satellites & Motor Sport applications all benefit from Harwin’s Datamate J-Tek in high shock and vibration environments Harwin has…

10 years ago

AAO Now Offers Ruggedized VITA 46 Compliant Connectors

Amphenol Aerospace, a global leader in interconnect technologies, now offers ruggedized VPX connectors that meet and exceed VITA 46 standards.…

10 years ago

Amphenol Industrial’s UPT Connector Series

Amphenol Industrial Products Group has expanded its PT series of connectors with a quick disconnect circular connector that is ideal…

10 years ago

Build SFP28 Modules for Data Centers and Radio Access with Industry’s First Transceiver IC in Mass Production

Keep heat away from lasers using Maxim Integrated’s transceiver chip and TO-can optics. Enables low-cost optics: Reduced module BOM through…

10 years ago

Molex Debuts Nano-Pitch I/O™ 80-Circuit Interconnect at DesignCon 2016 System offers highest port density and speed in the smallest available package

System offers highest port density and speed in the smallest available package LISLE, IL – March 9, 2016 – At…

10 years ago