Connectors & Cables

New Line of USB 2.0 and 3.0 Connectors Expands CUI’s Interconnect Portfolio

TUALATIN, Ore. — October 18, 2016 — CUI’s Components Group today announced an expansion to its existing portfolio of power, audio and signal connectors with the addition of a USB product line. The new connector family incorporates USB 2.0 and 3.0 connectors available in Type A, Type B, Micro AB, Micro B, Mini AB and Mini B USB versions. Able to support data rates up to 5 Gbps in USB 3.0 models, the new product family is ideal for a variety of I/O applications in consumer and portable electronic devices, including mobile computing equipment, digital audio devices and high volume storage products.

Offered in jack or plug connector types with horizontal or vertical orientations depending on the model, the new USB line boasts a number of mounting styles including surface mount, cable mount, mid mount SMT and through hole, allowing them to plug into virtually any design.

All models feature a voltage rating of 30 Vac, current ratings of 1 or 1.8 A and reliability as high as 10,000 mating cycles for specific models. Color insulator options of black, blue and white are also offered. The USB connectors also feature an operating temperature range of ‑25 to 85°C and RoHS compliance.

The entire product line of USB connectors are available immediately through distribution with prices starting at $0.23 per unit at 1500 pieces. Please contact CUI for OEM pricing. https://www.cui.com/contact

Summary
Product name: USB connectors
Availability: Stock to 5 weeks
Possible users: Consumer and portable electronics
Primary features: Variety of USB types and mounting options
Cost: $0.23 per unit at 1500 pieces

View CUI’s entire line of USB connectors
https://www.cui.com/catalog/components/connectors/usb

Liat

Recent Posts

Analog Devices to Acquire Alif Semiconductor for $1.35 Billion, Expanding Its Edge AI Platform

The planned acquisition will combine Analog Devices’ sensing, signal-processing, power and connectivity technologies with Alif’s…

1 day ago

Kyocera and Tohoku University Integrate Optical Isolator Directly on Silicon Photonics

A locally applied laser-annealing process enabled the researchers to crystallise magneto-optical garnet without exposing the…

1 day ago

NVIDIA and Palantir Deploy AI Stack to Manage NVIDIA’s Supply Chain

The system combines NVIDIA Nemotron open models with Palantir Foundry, AIP and Ontology. Its first…

4 days ago

Infineon extends collaboration with SolarEdge to enable solid-state protection for 800 VDC AI data centers

Companies extend collaboration into solid-state circuit breaker (SSCB) technology in line with leading industry framework…

5 days ago

Toyota and Rivian Adopt Stratasys’ New F870™ to Accelerate Factory-Floor Manufacturing Applications at Scale

New industrial FDM® platform expands Stratasys' production-grade portfolio with the longest heated build capacity in…

5 days ago

Imec advances scalable superconducting technology with world-first NbTiN circuits and 30nm interconnects

New superconducting digital program brings together foundries, system companies and hyperscalers around industry needs in…

6 days ago