Infineon launches SLC26P security controller based on 28 nm technology for payment applications; expands its supply option to enable long-term, dependable sourcing for smart card and embedded security ICs

New-Tech Magazines Group Ltd. Comments Off on Infineon launches SLC26P security controller based on 28 nm technology for payment applications; expands its supply option to enable long-term, dependable sourcing for smart card and embedded security ICs

Commercial production of integrated circuits using 28 nm technology node began several years ago. As the process technology has matured, market demand for 28 nm products has also increased. Although... Read More

Achieve maximum design flexibility with Molex Mirror Mezz Connectors

New-Tech Magazines Group Ltd. Comments Off on Achieve maximum design flexibility with Molex Mirror Mezz Connectors

Footprint-compatible Hermaphroditic Mirror Mezz connector lowers application costs with stackable mating to support data speeds up to 56 Gbps per differential pair for telecommunications, networking, and other applications. Contact details:... Read More

Infineon launches XENSIV™ connected sensor kit, a new IoT sensors platform

New-Tech Magazines Group Ltd. Comments Off on Infineon launches XENSIV™ connected sensor kit, a new IoT sensors platform

IoT ecosystems and connected devices enable new service offerings and peripheral services to be bought and unlocked. However, prototyping sensor-based IoT use cases can become a resource intensive process until... Read More

u-blox’s announces first cellular module featuring an embedded SIM (eSIM)

New-Tech Magazines Group Ltd. Comments Off on u-blox’s announces first cellular module featuring an embedded SIM (eSIM)

The SARA-R500E LTE-M module with an embedded SIM (eSIM) offers product developers an integrated, robust, and secure solution to connect size-constrained IoT applications to the cellular network. u-blox (SIX:UBXN), a... Read More

Infineon introduces the highly-integrated and scalable wireless charging platform WLC with Qi-compliant and configurable controllers

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Munich, Germany, and Taipei, Taiwan – 24 May, 2022 – The wireless charging market has been increasingly growing over the last years, with more and more applications applying this capability... Read More

Nexperia widens its offering of discrete components in miniature DFN packaging with side-wettable flanks

New-Tech Magazines Group Ltd. Comments Off on Nexperia widens its offering of discrete components in miniature DFN packaging with side-wettable flanks

Nexperia, the expert in essential semiconductors, today announced its latest product additions to a growing range of discrete devices which it provides in leadless DFN packages with side-wettable flanks (SWF). These... Read More

Infineon boosts IPOSIM platform with automated lifetime estimation to simplify selection of suitable semiconductor components

https://www.infineon.com/cms/en/about-infineon/press/market-news/2022/INFIPC202203-063.html Comments Off on Infineon boosts IPOSIM platform with automated lifetime estimation to simplify selection of suitable semiconductor components

Infineon Power Simulation platform (IPOSIM) from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is widely used for calculating losses and thermal behavior of power modules, discretes and disc devices.... Read More