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Toshiba Memory Corporation Develops World’s First 3D Flash Memory with TSV Technology

www.toshiba-memory.co.j July 11, 2017 Comments Off on Toshiba Memory Corporation Develops World’s First 3D Flash Memory with TSV Technology

Toshiba Memory Corporation, the world leader in memory solutions, today announced development of the world’s first[1] BiCS FLASH™ three-dimensional (3D) flash memory[2] utilizing Through Silicon Via (TSV)[3] technology with 3-bit-per-cell (triple-level cell, TLC)... Read More

Analog Devices’ Versatile 50 Mbps RS-485 Transceiver Series Protects Communication in Harsh Environments

www.analog.com June 28, 2017 Comments Off on Analog Devices’ Versatile 50 Mbps RS-485 Transceiver Series Protects Communication in Harsh Environments

Analog Devices, Inc. today announced the availability of two 50 Mbps RS-485/RS-422 transceivers for use in harsh environments including industrial automation, motor control, military and avionics. The ADM3065E and ADM3066E transceivers... Read More

72V Fixed-Ratio DC/DC Controller Eliminates Power Inductor & Delivers 500W in Non-Isolated Intermediate Bus Converter Applications

June 22, 2017 Comments Off on 72V Fixed-Ratio DC/DC Controller Eliminates Power Inductor & Delivers 500W in Non-Isolated Intermediate Bus Converter Applications

Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTC7820, a high power fixed ratio charge pump DC/DC controller that eliminates the power inductor in a non-isolated intermediate... Read More

Infineon extends industry-leading smart power switches with PROFET™+2 and High Current PROFET™ for improved energy efficiency and miniaturization

www.infineon.com June 22, 2017 Comments Off on Infineon extends industry-leading smart power switches with PROFET™+2 and High Current PROFET™ for improved energy efficiency and miniaturization

Car makers want in-vehicle electronic systems to provide a large number of energy-efficient functions in as little space as possible. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) supports this... Read More

Alliance Memory Introduces New Die Version for 2Gb and 4Gb DDR3 and DDR3L SDRAMs; Provides New Memory Chip Source in Face of Market Shortages

June 21, 2017 Comments Off on Alliance Memory Introduces New Die Version for 2Gb and 4Gb DDR3 and DDR3L SDRAMs; Provides New Memory Chip Source in Face of Market Shortages

 To address the memory market’s shortage of high-speed CMOS DDR3 and low-voltage DDR3L SDRAMs, Alliance Memory today announced a new die revision (B die) for its 2Gb and 4Gb devices... Read More

Broadcom Delivers High Performance Data Plane Programmability with new Trident 3 Generation of 10/25/100G Ethernet Switches

www.broadcom.com June 18, 2017 Comments Off on Broadcom Delivers High Performance Data Plane Programmability with new Trident 3 Generation of 10/25/100G Ethernet Switches

Broadcom Limited (NASDAQ:AVGO), today announced immediate availability of the first members of its breakthrough Trident 3 family of programmable switches for data center, enterprise, and service provider networks transitioning to high density 10/25/100G... Read More