Components

ON Semiconductor Introduces New Industrial and Automotive Qualified SiC MOSFETs Complementing a Growing Ecosystem and Bringing Wide Band Gap Performance Benefits to Rapid Growth Applications

ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has introduced two new silicon carbide (SiC) MOSFET devices. The industrial grade…

7 years ago

Samsung Launches Highest-capacity Mobile DRAM to Accommodate Next-generation Smartphones

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the highest-capacity mobile…

7 years ago

REAL3™ Time-of-Flight image sensor: fourth generation with HVGA resolution for high quality photo effects and more

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is presenting the fourth generation of its REAL3™ image sensor IRS2771C at…

7 years ago

Industry’s first automotive USB 3.1 SmartHub with Type-C™ support enables 10x faster data rates in infotainment systems

Microchip announces an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB…

7 years ago

Toshiba Image Recognition SoC for Automotive Applications Integrates a Deep Neural Network Accelerator

Toshiba Electronics Europe GmbH (TEE) today announced development of an image recognition SoC (System on Chip) for automotive applications that…

7 years ago

e-peas Applies its Ultra-Low Power Technology to Thermally-Based Energy Harvesting

e-peas has announced the introduction of a new power management IC specifically optimized for energy harvesting from thermal sources in…

7 years ago

New TWIN SerDes devices in the APIX3 family from Inova Semiconductors

Two new APIX3 SerDes TWIN transmitters, each with two independent transmission channels, are now available from Inova Semiconductors. APIX (Automotive…

7 years ago

ON Semiconductor Introduces the RSL10 Sensor Development Kit for Power-Optimized IoT Applications

Out-of-the-box sensor platform provides enhanced sensor technology with industry’s lowest power Bluetooth® Low Energy NUREMBERG, Germany – 13 February, 2019…

7 years ago

Xilinx Introduces HDMI 2.1 IP Subsystem

Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive and intelligent computing, today announced that it has introduced a complete HDMI™ 2.1 IP…

7 years ago

Samsung Breaks Terabyte Threshold for Smartphone Storage with Industry’s First 1TB Embedded Universal Flash Storage

Samsung Electronics, the world leader in advanced memory technology, announced that it has begun mass producing the industry’s first one-terabyte…

7 years ago