Components

Microchip Teams Up with Intelligent Hardware Korea (IHWK) to Develop an Analog Compute Platform to Accelerate Edge AI/ML Inferencing

Using Microchip’s memBrain™ nonvolatile in-memory compute technology and working with universities, IHWK is creating a SoC processor for neurotechnology devices…

8 months ago

u-blox introduces its newest dual-band GNSS module, optimal for meter-level position accuracy in urban environments

The u-blox NEO-F10N is based on the u-blox F10 platform, equipped with L1/L5 dual-band technology and effective multipath mitigation. Thalwil,…

8 months ago

Ease of Design for OEMs to Connect Automotive Devices with New 10BASE-T1S Ethernet Solutions

The new family of LAN8650/1 MAC-PHY devices connects low-cost microcontrollers without a built-in Ethernet MAC to a 10BASE-T1S Ethernet network…

8 months ago

Infineon extends its PQFN 2×2 mm² product portfolio with best-in-class OptiMOS™ power MOSFETs

Munich, Germany – July 26, 2023 – A small footprint of discrete power MOSFETs plays a critical role in achieving…

9 months ago

Renesas Automotive MCU and SoC Cybersecurity Management Certified to ISO/SAE 21434:2021

A Structured Cybersecurity Management System Ensures Holistic Cybersecurity Practices Across The Entire Device Life Cycle OKYO, Japan ― Renesas Electronics Corporation…

10 months ago

Infineon adds 650 V TOLL portfolio to its CoolSiC™ MOSFET family for better thermal performance, power density, and easier assembly

Munich, Germany – 19 July, 2023 – As digitalization, urbanization, and the rise of electro-mobility continue to shape the rapidly…

10 months ago

u-blox introduces the smallest LTE-M / NB-IoT module with 23 dBm RF output power and 2G fallback

The u-blox LEXI-R4 is the newest compact 16 x 16 mm module with 2G fallback capability. Thalwil, Switzerland – July 18,…

10 months ago

New 600 V discrete IGBTs from Nexperia for class-leading efficiency in power applications

Empowering power electronics designers with robust, 175 °C qualified IGBTs with fully rated fast recovery diodes. Nijmegen, July 5, 2023: Nexperia,…

10 months ago

Teledyne e2v and Infineon partner on optimized processor boot solution for high reliability edge computing space systems

Munich, Germany, and Grenoble, France – 6 July, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Teledyne…

10 months ago

1/16th brick footprint DC-DC buck converter series expanded with 60A models and adjustable current limit

TDK Corporation (TSE 6762) announces the expansion of the TDK-Lambda i7A series of non-isolated buck DC-DC converters with the industry-standard…

10 months ago