NEW PRODUCTS

ROHM Offers LogiCoA™: the Industry’s First* Analog-Digital Fusion Control Power Supply Solution

Provides functions equivalent to a fully digital control power supply with low power consumption Willich-Münchheide, Germany, July 10, 2024 –…

2 years ago

Nexperia’s 650 V ultra- and hyperfast recovery rectifiers in D2PAK Real-2-Pin packaging offer high efficiency and reliability

Package configuration allows rectifiers to comply with higher creepage and clearance standards Nexperia today released 650 V ultra- and hyperfast…

2 years ago

Autotalks and Rolling Wireless Accelerate 5G-V2X Deployment in Automotive and E-bike Markets

Rolling Wireless’ RX135x, the first V2X module based on Autotalks’ state-of-the-art SECTON3 chipset, is available for customer programs with Start…

2 years ago

Nordic Semiconductor launches new component reels made from recycled plastics

Working with its assembly and test partners, Nordic now using recycled plastic component packaging reels  Nordic Semiconductor, a leader in…

2 years ago

Enclustra unveils ultra-compact Pluto series: Bringing the power of FPGA to portable solutions

The coin-sized system-on-module (SoM) combines embedded intelligence and portability, accelerating the development of compact, low-power applications in industry, healthcare, and…

2 years ago

u-blox empowers global connectivity with new ultra-compact LTE Cat 1bis cellular modules

The LEXI-R10 series, the world’s smallest LTE Cat 1bis module, now includes a global variant for worldwide connectivity. The new…

2 years ago

Melexis miniaturizes LED drivers for automotive lighting

 Melexis, an influential player in automotive LED drivers for ambient lighting, announces the extension of its LIN RGB family with…

2 years ago

CML launches Ka-band GaN power amplifier for cost-effective development of commercial satcom terminals

Maldon, Essex, UK – CML Micro has announced the launch of a Ka-band gallium nitride (GaN) power amplifier that represents…

2 years ago

ROHM’s New TRCDRIVE pack™ with 2-in-1 SiC Molded Module: Significantly Reduces the Size of xEV Inverters

Achieves industry-leading* power density by integrating 4th Generation SiC MOSFETs in a compact package ROHM has developed four models as…

2 years ago

NEW ICeGaN GaN POWER ICs ENABLE THE HIGHEST EFFICIENCY LEVELS FOR DATA CENTRES, INVERTERS AND INDUSTRIAL SMPS

Cambridge GaN Devices (CGD), the fabless, clean-tech semiconductor company that develops energy-efficient GaN-based power devices that make greener electronics possible,…

2 years ago