LATEST NEWS

Nexperia’s 650 V ultra- and hyperfast recovery rectifiers in D2PAK Real-2-Pin packaging offer high efficiency and reliability

Package configuration allows rectifiers to comply with higher creepage and clearance standards

Nexperia today released 650 V ultra- and hyperfast recovery rectifiers in D2PAK Real-2-Pin (R2P) packaging for use in various automotive, industrial and consumer applications including charging adapters, photovoltaic (PV), inverters, servers and switched mode power supplies (SMPS).

Combining planar die technology with a state-of-the-art junction termination (JTE) design, these rectifiers offer high power density, fast switching times with soft recovery and excellent reliability. They are encapsulated in a D2PAK Real-2-Pin Package (SOT8018), which offers the same package outline as the standard D2PAK package but has only two pins instead of three (the middle cathode pin has been removed). This increases the pin-to-pin distance from 1.25mm to over 4mm, which allows to meet the creepage and clearance requirements stated in the IEC 60664 standard.

“These recovery rectifiers further demonstrate Nexperia’s expertise in the field of semiconductor device packaging” according to Frank Matschullat, Head of Product Group Power Bipolar Discretes at Nexperia. “By taking the innovative step of removing the cathode pin from a standard D2PAK package, Nexperia has created a Real-2-Pin package that can meet the creepage and clearance requirements, in particular for high voltage automotive applications.”

To learn more about Nexperia’s portfolio of recovery rectifiers, visit: https://www.nexperia.com/products/diodes/recovery-rectifiers


Credit:Nexperia

Danit

Recent Posts

60W DOE Level VII ready IP42-sealed wall-mount adapters for medical, home healthcare, and industrial applications

XP Power introduces the AMF60 series of 60W wall-mount AC-DC power supplies for medical, home…

2 days ago

ROHM launches an Ultra-Compact Wireless Power Chipset for Wearables

ROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 -…

2 days ago

Microchip Expands its Family of Post-Quantum Ready Root of Trust Controllers for Next Generation Systems

Platform Root of Trust and secure boot controllers help system architects prepare for emerging mandates…

2 days ago

AU10TIX Advances Privacy-First Approach to Age Assurance as Regulatory Pressure Increases

AU10TIX, a global leader in identity verification and fraud prevention, is further advancing its privacy-first approach to age…

2 days ago

New Samtec SMA Interconnects Capable of 26.5 GHz

Samtec, Inc. announces availability of 26.5 GHz SMA interconnects supporting test & measurement, military, aerospace…

2 days ago

Tower Semiconductor and Axiro Semiconductor Deliver High-Power, High-Efficiency SiGe ICs for Secure U.S. Defense Applications

Leveraging Tower's advanced SiGe technology, these U.S.-fabricated Beamforming ICs achieve superior performance, and strengthen secure…

3 days ago