NXP Expands Industry’s Broadest Matter Portfolio with New, Secure Wireless MCUs

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NXP Semiconductors (NASDAQ: NXPI) today announced new devices designed to simplify the development of IoT and industrial IoT solutions. Adding to NXP’s expanding portfolio of end-to-end Matter solutions, the RW612... Read More

6G project opens up new possibilities for connected mobility

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The 6G-ICAS4Mobility project is laying the groundwork for the next generation of wireless mobile technology The publicly funded 6G-ICAS4Mobility project is working on fundamental aspects of the next generation of... Read More

Intel Hits Key Milestone in Quantum Chip Production Research

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Intel demonstrates exceptional yield of quantum dot arrays, showing promise for large-scale qubit production using transistor fabrication technology. The Intel Labs and Components Research organizations have demonstrated the industry’s highest... Read More

Arrow Electronics Announces $600 Million Increase to Share Repurchase Authorization

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CENTENNIAL, Colo.–(BUSINESS WIRE)– Arrow Electronics, Inc. (NYSE:ARW) announced today the approval by the company’s Board of Directors of the repurchase of up to an additional $600 million of common stock through... Read More

VoloDrone Completes Deconfliction Flights in Germany

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 Volocopter, the pioneer of urban air mobility (UAM) has completed a two-week test flight campaign for its multirotor heavy-lift cargo carrier, the VoloDrone. The campaign was run at the DLR... Read More

Avnet Abacus and Molex celebrate 40 years in business

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Avnet Abacus, one of Europe’s leading interconnect, passive, electro-mechanical and power distributors and a regional business unit of Avnet (NASDAQ: AVT), celebrated 40 years of working with Molex, a world... Read More

Cloud service ends with €8.5 million awarded to researchers

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Europe’s largest cloud adoption project will formally conclude this month, having given a million researchers access to Google, Amazon, and Orange commercial cloud services over the past three years. Europe’s... Read More

The Israeli Redler Technologies has signed a memorandum of understanding (MOU) with Steel Strip Wheels Limited (“SSWL”)

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Redler Technologies (“Redler”) Ltd.-an Israel based global engineering company  and Steel Strip Wheels Limited (“SSWL”) India- a global leader in the Automotive Wheel Maker industry announce today the signing of... Read More