STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and Quantenna Communications, Inc., the leader of ultra-high performance Wi-Fi, announced the availability of a reference design... Read More

Cadence Design Systems, Inc.  today announced that its audio core for system-on-chip (SoC) designs has been approved for using the Dolby® MS12 Multistream Decoder, an all-in-one audio solution for TVs... Read More

Ericsson (NASDAQ:ERIC) launches three new solutions to equip communication service providers and utility companies to address services and requirements in the fast-growing Internet of Things (IoT) market. Those new additions... Read More

Dr. Hong, the President of Samsung SDS and the Head of its solution business, described Samsung’s devices and components, platforms and security solutions as the key ingredients that “bring ‘smarts’... Read More

Annapurna Labs, an Amazon Company, Announces Availability of Home Network and Storage Platform-on-Chip and Subsystem Solutions Alpine product line is a foundation for next-generation digital services for the connected home... Read More

GlobalFoundries, TSMC, SK Hynix show greatest gains in wafer capacity in 2015. IC Insights has released its Global Wafer Capacity 2016-2020 report that provides in-depth detail and analysis of IC... Read More

Panasonic Signs Partnership to Deliver Visual Solutions For the Rio 2016 Olympic and Paralympic Ceremonies;Panasonic Becomes Official Ceremony Partner for the First Time Osaka, Japan – Panasonic Corporation announced today... Read More