Celebrating the 10th season, Intel Extreme Masters returns to Katowice, Poland, as the world will watch the best professional players compete for over US$600,000. Intel will be present to show... Read More
Thinfilm Receives Order from Global FMCG Leader for NFC SpeedTap Tags
Delivery of 5-Figure Unit Order to be Completed in H1 2016; Interest in Thinfilm’s NFC Solutions Product Line Continues to Grow OSLO, Norway, February , 2016 – Thin Film Electronics ASA... Read More
Qualcomm Announces Three New Snapdragon Processors that Bring Advanced Modem, Imaging and Sensors to Mainstream Devices
Making premium-tier features available to more affordable smartphones around the world Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., has introduced three new next-generation Qualcomm® Snapdragon™... Read More
Diffbot Raises $10M Series A to Become Leading Arms Dealer in Coming AI Wars
All-star investors back team of 12 world-class AI engineers synthesizing the world’s largest database of structured information, providing “knowledge-as-a-service” to tech giants PALO ALTO—Today, Diffbot announced that the company secured... Read More
Aeris and Digi-Key Offer an Innovative IoT Connectivity Platform
Obtaining and managing connectivity from the Aeris Neo platform is easier, faster, and gets your IoT project up and running quickly Global electronic components distributor Digi-Key Electronics, the industry leader... Read More
Honeywell Develops Virtual Reality Technology for Future DARPA and U.S. Army Ground Vehicles
First-of-its-kind virtual instrument panel could give drivers better awareness and more information for improved mission success PHOENIX, Feb. 11, 2016 /PRNewswire/ — Honeywell (NYSE: HON) has signed an agreement with the Defense... Read More
IoT Chip Market worth 10.78 Billion USD by 2022
The IoT chip market is expected to grow from USD 4.58 Billion in 2015 to USD 10.78 Billion by 2022, at a CAGR of 11.5% between 2016 and 2022. With... Read More
Orion Crew Module Processing Begins For First Mission Atop Space Launch System
The Orion crew module pressure vessel has arrived at Kennedy Space Center in Florida and is now secured in an upgraded version of a test stand called the “birdcage” inside... Read More
Orbotech Collaborates with Nippon Mektron to Optimize Digital Flexible Printed Circuit Board Manufacturing
ORBOTECH LTD.(NASDAQ: ORBK) today announced that, Nippon Mektron Mektec, the world’s most dominant maker of flexible printed circuit boards (FPCBs), is deploying Orbotech direct imaging (DI) and automated optical inspection... Read More
INTRODUCING TOUCH-ENABLED QUICK COVER FOR YET-TO-BE-ANNOUNCED LG G5
Introducing a Case for a Smartphone That Does Not Officially Exist G Electronics (LG) took the wraps off a new version of its Quick Cover case, designed specifically for LG’s... Read More
























