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Electromagnetic and Electronics Simulation on the 3DEXPERIENCE Platform

July 24, 2016 Comments Off on Electromagnetic and Electronics Simulation on the 3DEXPERIENCE Platform

Dassault Systèmes (Euronext Paris: #13065, DSY.PA), the 3DEXPERIENCE Company, world leader in 3D design software, 3D Digital Mock Up and Product Lifecycle Management (PLM) solutions, today announced that it has... Read More

Future Electronics and Robert Miller Establish Interconnect Business Development Management Group

https://future.distributorpress.com/ July 24, 2016 Comments Off on Future Electronics and Robert Miller Establish Interconnect Business Development Management Group

Summary: Future Electronics and President Robert Miller have established an Interconnect Business Development Management group, to ensure best in class support in providing Interconnect solutions for customers. Future Electronics, a... Read More

UKTV extends broadcast services contract with Ericsson

July 21, 2016 Comments Off on UKTV extends broadcast services contract with Ericsson

Multi-year contract includes playout services for UKTV’s award-winning portfolio of 10 channels, and media management for video on demand services including UKTV Play Additionally Ericsson will continue to provide subtitling... Read More

Real-time bomb scanner to revolutionise airport security

www.photonics21.org July 21, 2016 Comments Off on Real-time bomb scanner to revolutionise airport security

A team of European scientists have created a real-time, hand-held chemical sensor that will increase airport safety, reduce car emissions, and combat unnecessary food wastage. The device can scan from... Read More

The world’s first universal non-electrical Wi-Fi amplifier

July 21, 2016 Comments Off on The world’s first universal non-electrical Wi-Fi amplifier

ZeusPro’s purpose is to make sure you get a flawless WiFi signal at every required spot. ZeusPro significantly improves your reception range, either when transmitting a signal or when receiving... Read More

Another Big Shrink: Tiling Chiplets into Next-Generation Microsystems

https://www.darpa.mil | outreach@darpa.mil July 20, 2016 Comments Off on Another Big Shrink: Tiling Chiplets into Next-Generation Microsystems

A novel approach to going small could miniaturize entire circuit boards of chips into single modular chips that combine the best of commercial and DoD circuit designs and technology. Open... Read More