Nokia Bell Labs, Deutsche Telekom T-Labs and Technical University of Munich achieve speeds of 1 Tb per second in groundbreaking optical technology trial

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In jointly conducted research of optical systems, Nokia Bell Labs, Deutsche Telekom T-Labs and the Technical University of Munich achieved a 1 Terabit-per-second transmission rate over optical fiber Probabilistic Constellation... Read More

New test to improve commercial viability of printable electronics

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Scientists at the National Physical Laboratory (NPL) have developed a new, non-destructive method of detecting the orientation of molecules in organic semiconductor transistors using Raman spectroscopy. This will create a... Read More

GE’s Steam Power Systems to deliver $1.9 Billion Contract for Hinkley Point C Nuclear Power Station in the United Kingdom

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Today, GE (NYSE: GE) confirmed that it received approval of its $1.9 billion contract for EDF Energy’s Hinkley Point C nuclear power project. Steam Power Systems, part of GE Power,... Read More

New Fabric Uses Sun and Wind to Power Devices

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Fabrics that can generate electricity from physical movement have been in the works for a few years. Now researchers at Georgia Institute of Technology have taken the next step, developing... Read More

DenciTec® – PCB technology that takes miniaturization to the next level

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Cicor (SIX Swiss Exchange: CICN), a leading international high-tech industrial group based in Boudry (Switzerland) specializing in printed circuit boards, microelectronics and electronic solutions, has launched a new technology platform... Read More

TI unveils first ultra-low power dual-band wireless MCU in production

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Monitor IoT networks from a handheld device with TI’s single-chip Sub-1 GHz and Bluetooth® low energy solution available today Expanding the functionality of Internet of Things (IoT) networks, Texas Instruments... Read More

Premiere in Berlin: the ICE 4 has arrived

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Berlin, 2016-Sep-14 DB CEO Grube: “ICE 4 is the backbone of our new long-distance transport system” Transportation Minister Dobrindt: “Upgrade of high-speed train travel” Siemens Managing Board Member Busch: “Numerous... Read More

Microsemi Announces New Addition to its Imaging/Video Solution to Support Growing Demand for MIPI CSI-2 Interfaces

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Enhancements Enable Customers to Use Company’s Low Power, Highly Secure IGLOO2 FPGAs and SmartFusion2 SoC FPGAs in CSI-2-Based Camera Systems ALISO VIEJO, Calif.—Sept. 13, 2016—Microsemi Corporation (Nasdaq: MSCC), a leading... Read More