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NI Announces the Next Generation of USRP RIO Software Defined Radio Solutions for Design, Prototyping and Deployment

www.ni.com February 23, 2017 Comments Off on NI Announces the Next Generation of USRP RIO Software Defined Radio Solutions for Design, Prototyping and Deployment

the provider of platform-based systems that enable engineers and scientists to solve the world’s greatest engineering challenges, today announced the availability of the USRP-2945 quad receiver SDR device and the... Read More

DuPont Electronics & Communications and Holst Centre Extend Collaboration On Printed Electronics Research and Application Development

February 23, 2017 Comments Off on DuPont Electronics & Communications and Holst Centre Extend Collaboration On Printed Electronics Research and Application Development

BRISTOL, UK and EINDHOVEN, Netherlands, Feb. 23, 2017 – DuPont Electronics & Communications (DuPont) and Holst Centre today announced the third extension of their successful long-term collaboration, which is focused... Read More

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Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity

www.icinsights.com February 23, 2017 Comments Off on Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity

IC Insights recently released its new Global Wafer Capacity 2017-2021 report that provides in-depth detail, analyses, and forecasts for IC industry capacity by wafer size, by process geometry, by region,... Read More

First Joint Live Demonstration of Gigabit LTE Using Aggregation of Licensed and Unlicensed Spectrum with a Commercial Modem Chipset with AT&T, Ericsson, Orange and Qualcomm

www.qualcomm.com February 23, 2017 Comments Off on First Joint Live Demonstration of Gigabit LTE Using Aggregation of Licensed and Unlicensed Spectrum with a Commercial Modem Chipset with AT&T, Ericsson, Orange and Qualcomm

T&T, Ericsson, Orange and Qualcomm Incorporated (NASDAQ: QCOM) through its subsidiary, Qualcomm Technologies, Inc., are collaboration to show Gigabit LTE using License Assisted Access (LAA) technology. With LAA, data speeds... Read More

Xilinx Unveils Disruptive Integration and Architectural Breakthrough for 5G Wireless with RF-Class Analog Technology

https://press.xilinx.com February 23, 2017 Comments Off on Xilinx Unveils Disruptive Integration and Architectural Breakthrough for 5G Wireless with RF-Class Analog Technology

Today announced a disruptive integration and architectural breakthrough for 5G wireless with the infusion of RF-class analog technology into its 16nm All Programmable MPSoCs. Xilinx’s new All Programmable RFSoCs eliminate... Read More

NXP Launches Multi-Standard Programmable Family of System on Chip Solutions

https://media.nxp.com February 23, 2017 Comments Off on NXP Launches Multi-Standard Programmable Family of System on Chip Solutions

NXP Semiconductors™ N.V. (NASDAQ:NXPI), a worldwide leader in advanced secure connectivity solutions, today announced a new family of fully programmable, multi-standard SoCs for multi-access technologies including 5G evolution. The Layerscape... Read More