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CEVA Introduces the World’s Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity

February 24, 2017 Comments Off on CEVA Introduces the World’s Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity

CEVA-XC12 is the industry’s first DSP capable of meeting the extreme performance requirements critical to the success of 5G, gigabit LTE, MU-MIMO Wi-Fi and other multi-gigabit modems – Revolutionary processor... Read More

ON Semiconductor Sampling Industry’s Lowest Power Bluetooth® Low Energy SoC for IoT and Connected Health & Wellness

February 24, 2017 Comments Off on ON Semiconductor Sampling Industry’s Lowest Power Bluetooth® Low Energy SoC for IoT and Connected Health & Wellness

Highly flexible Bluetooth 5 certified Radio System-on-Chip (SoC) provides faster data rates & greater functionality while maximizing system battery life Mobile World Congress – BARCELONA, Spain – February 23, 2017... Read More

UCSD and TowerJazz Demonstrate Best in Class 5G Mobile Transmit-Receive Chips with Greater than 12 Gbps Data Rates

February 23, 2017 Comments Off on UCSD and TowerJazz Demonstrate Best in Class 5G Mobile Transmit-Receive Chips with Greater than 12 Gbps Data Rates

TowerJazz, the global specialty foundry leader, and The University of California, San Diego (UCSD), a recognized leader for microwave, millimeter-wave, mixed-signal RFICs, and phased arrays, demonstrate for the first time,... Read More

New research shows perception of STEM subjects is improving

www.baesystems.com February 23, 2017 Comments Off on New research shows perception of STEM subjects is improving

Combined efforts by teachers, industry, engineering organisations and the Government to change the perception of science, technology, engineering and maths (STEM), are starting to bear fruit as 51 per cent... Read More

NI Announces the Next Generation of USRP RIO Software Defined Radio Solutions for Design, Prototyping and Deployment

www.ni.com February 23, 2017 Comments Off on NI Announces the Next Generation of USRP RIO Software Defined Radio Solutions for Design, Prototyping and Deployment

the provider of platform-based systems that enable engineers and scientists to solve the world’s greatest engineering challenges, today announced the availability of the USRP-2945 quad receiver SDR device and the... Read More

DuPont Electronics & Communications and Holst Centre Extend Collaboration On Printed Electronics Research and Application Development

February 23, 2017 Comments Off on DuPont Electronics & Communications and Holst Centre Extend Collaboration On Printed Electronics Research and Application Development

BRISTOL, UK and EINDHOVEN, Netherlands, Feb. 23, 2017 – DuPont Electronics & Communications (DuPont) and Holst Centre today announced the third extension of their successful long-term collaboration, which is focused... Read More

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Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity

www.icinsights.com February 23, 2017 Comments Off on Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity

IC Insights recently released its new Global Wafer Capacity 2017-2021 report that provides in-depth detail, analyses, and forecasts for IC industry capacity by wafer size, by process geometry, by region,... Read More

First Joint Live Demonstration of Gigabit LTE Using Aggregation of Licensed and Unlicensed Spectrum with a Commercial Modem Chipset with AT&T, Ericsson, Orange and Qualcomm

www.qualcomm.com February 23, 2017 Comments Off on First Joint Live Demonstration of Gigabit LTE Using Aggregation of Licensed and Unlicensed Spectrum with a Commercial Modem Chipset with AT&T, Ericsson, Orange and Qualcomm

T&T, Ericsson, Orange and Qualcomm Incorporated (NASDAQ: QCOM) through its subsidiary, Qualcomm Technologies, Inc., are collaboration to show Gigabit LTE using License Assisted Access (LAA) technology. With LAA, data speeds... Read More

Xilinx Unveils Disruptive Integration and Architectural Breakthrough for 5G Wireless with RF-Class Analog Technology

https://press.xilinx.com February 23, 2017 Comments Off on Xilinx Unveils Disruptive Integration and Architectural Breakthrough for 5G Wireless with RF-Class Analog Technology

Today announced a disruptive integration and architectural breakthrough for 5G wireless with the infusion of RF-class analog technology into its 16nm All Programmable MPSoCs. Xilinx’s new All Programmable RFSoCs eliminate... Read More

NXP Launches Multi-Standard Programmable Family of System on Chip Solutions

https://media.nxp.com February 23, 2017 Comments Off on NXP Launches Multi-Standard Programmable Family of System on Chip Solutions

NXP Semiconductors™ N.V. (NASDAQ:NXPI), a worldwide leader in advanced secure connectivity solutions, today announced a new family of fully programmable, multi-standard SoCs for multi-access technologies including 5G evolution. The Layerscape... Read More