Paper Is One of 15 that Leti Presented at European Conference on Antennas and Propagation March 19-24 Leti, a research institute of CEA Tech, presented a paper at the 11th European... Read More

New 3-D-printed device mimics the goldbug beetle, which changes color when prodded. In this age of smartphones and tablet computers, touch-sensitive surfaces are everywhere. They’re also brittle, as people with... Read More

Microsoft Corp. on Wednesday announced a new patent licensing agreement with Toyota Corp. that includes broad coverage for connected car technologies. Today’s agreement builds on Toyota and Microsoft’s strong partnership,... Read More

Samsung Electronics, a world leader in advanced semiconductor technology, today announced a successful network processor tape-out based on Samsung’s 14LPP (Low-Power Plus) process technology in close collaboration with eSilicon and... Read More

TDK Corporation announces the expansion of its long-term partnership between TDK-Micronas, a TDK group company, and Endrich. As of today, Endrich Bauelemente Vertriebs GmbH is TDK-Micronas GmbH’s franchise partner for... Read More

Organic light-emitting devices and printed electronics can be connected to a socket in the wall by way of a small, inexpensive organic converter, developed in a collaboration between Linköping University... Read More

Stuttgart / Uusikaupunki, Finland – Mercedes-Benz continues its successful cooperation with Valmet Automotive: The Finnish contract manufacturer will produce the next generation of compact cars at its plant in Uusikaupunki.... Read More

This transaction strengthens Ficosa’s economic capacity, while also fostering technological collaboration, regional and customer synergies with Panasonic Panasonic has increased its share in Ficosa by 20% in order to speed... Read More

The site in Coventry, central England, “has the capacity to build more than 20,000 vehicles per year… the best ultra-low emission commercial vehicles in the world”, LTC said in a... Read More