Two leading European research institutes today announced their new collaboration to develop innovative, next-generation microelectronics technologies to spur innovation in their countries and strengthen European strategic and economic sovereignty. Leti,... Read More
Picosun’s ALD solutions enable novel high-speed memories
Picosun’s ALD solutions enable novel high-speed memories – Picosun Picosun Oy, leading supplier of high quality Atomic Layer Deposition (ALD) thin film coating solutions, reports of breakthrough results achieved with... Read More
Litigation Against Western Digital Corporation
TOKYO—Toshiba Corporation and Toshiba Memory Corporation today filed a petition with the Tokyo District Court against Western Digital Corporation, a U.S. company, and its subsidiary Western Digital Technologies, Inc. (collectively,... Read More
Informational and educational activities about passive components
Waldenburg/Germany, Lanskroun/Czech Republic, 29 June 2017 – Würth Elektronik eiSos is pleased to announce its cooperation with and support for the European Passive Components Institute s.r.o. (EPCI). The cooperation includes... Read More
Nonstop CMOS Image Sensor Sales Records Seen Through 2021
Embedded imaging applications in cars, security, machine vision, medical, virtual reality, wearable systems, and other new uses will offset slow growth in camera phones, says report. CMOS image sensor sales... Read More
Samsung Introduces Image Sensor Brand ‘ISOCELL’ at 2017 MWC Shanghai
Samsung Electronics, a world leader in advanced semiconductor technology, today introduced its image sensor brand ‘ISOCELL®’ as well as demonstrated leading-edge solutions at the 2017 Mobile World Congress (MWC) Shanghai.... Read More
Intel Takes Another Major Step in Memory Leadership
Intel has delivered the world’s first commercially available 64-layer, TLC, 3D NAND solid state drive (SSD). While others have been talking about it, we have delivered. Today we are announcing... Read More
Qualcomm Announces Advanced Fingerprint Scanning and Authentication Technology
At Mobile World Congress Shanghai 2017, Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), today announced Qualcomm® Fingerprint Sensors, next-generation ultrasonic fingerprint solutions which bring new and enhanced... Read More
SES and MDA Announce First Satellite Life Extension Agreement
LUXEMBOURG–(BUSINESS WIRE)–SES (Euronext Paris:SESG) (LuxX:SESG) and MDA, a global communications and information company, announced today an agreement for an initial satellite life extension mission using an on-orbit refuelling vehicle being... Read More
Robots to Enhance, not Replace Humans in most Jobs: ARM Survey
CAMBRIDGE, England–(BUSINESS WIRE)–Consumers who believe AI will lead to rampaging, job-taking robot chaos are in the minority according to an ARM-commissioned independent global survey of nearly 4000 consumers. When considering... Read More
























