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60W DOE Level VII ready IP42-sealed wall-mount adapters for medical, home healthcare, and industrial applications
ROHM launches an Ultra-Compact Wireless Power Chipset for Wearables
Microchip Expands its Family of Post-Quantum Ready Root of Trust Controllers for Next Generation Systems
AU10TIX Advances Privacy-First Approach to Age Assurance as Regulatory Pressure Increases
New Samtec SMA Interconnects Capable of 26.5 GHz
Tower Semiconductor and Axiro Semiconductor Deliver High-Power, High-Efficiency SiGe ICs for Secure U.S. Defense Applications
TytoCare Secures FDA De Novo for First AI-Powered Eardrum Analysis
Rohde & Schwarz awarded contract by Israel Airports Authority for QPS201 security scanners
Rilian Secures $17.5 Million in Seed Funding to Advance Agentic AI for Cyber and Defense Operations
Quantum chips: Infineon contributes industrialization know-how to European quantum pilot lines

CPT and imec / Holst Centre Demonstrate 1250 ppi, FMM-free Multicolor OLED Displays with Photolithography

September 20, 2017 Comments Off

Taipei, Taiwan ROC, September 20, 2017 – Chunghwa Picture Tubes Ltd. (CPT) together with the European research institute imec in the framework of the Holst Centre collaboration, showcase today an ultra-high... Read More

Finnish mobile device for detecting arrhythmia soon available for consumers

September 20, 2017 Comments Off

The VTT spin-off, VitalSignum, is making a small mobile device – which detects arrhythmia by measuring the patient’s ECG – available to consumers. The first production batch is being completed... Read More

Leading-Edge Paves the Way For Pure-Play Foundry Growth

https://www.icinsights.com September 20, 2017 Comments Off

Sales of ICs built using <40nm process technology forecast to rise 18% at pure-play foundries. IC Insights has just released its September Update to The McClean Report. This 32-page Update... Read More

Europe’s largest innovation platform STARTUP AUTOBAHN launches its third 100-day program in Stuttgart

September 20, 2017 Comments Off

Stuttgart. Europe’s largest innovation platform – STARTUP AUTOBAHN – is about to kick-off its third round. 500+ startups were screened for the program and 34 startups were accepted into Program... Read More

ams further expands Singapore manufacturing capacity to address global demand for optical sensor solutions

September 20, 2017 Comments Off

New JTC nanoSpace @ Tampines facility follows expansion in Ang Mo Kio earlier this year Singapore (20 September, 2017) — ams (SIX: AMS), a leading worldwide supplier of high performance... Read More

CPI Appoints Jennie Younger as New Non-Executive Chairman

September 20, 2017 Comments Off

The Centre for Process Innovation (CPI), the UK’s technology innovation provider for process manufacturing, today announced the appointment of Jennie Younger as its new Non-Executive Chairman. Jennie succeeds Bob Coxon... Read More

BAE Systems awards multimillion euro contract to Konstrukta-Defence,a.s in Slovak Republic

https://www.baesystems.com September 19, 2017 Comments Off

AE Systems has contracted with Konstrukta-Defence,a.s, a leading defence company in the Slovak Republic that operates as an artillery system design house, to produce barrels for the Swedish Army’s Mjölner... Read More

Renesas Electronics and Cogent Embedded Collaborate to Make 3D Surround View Parking Assist System Standard in All New Cars

www.renesas.com September 19, 2017 Comments Off

New Solution Combining Customizable 3D Surround View Software and R-Car V3M Realizes Parking Assist System Without Using GPU Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and... Read More

DNA Finland chooses Ericsson for metadata

www.ericsson.com September 19, 2017 Comments Off

Ericsson will provide editorial services and rich metadata for over 150 TV channels in Finnish, English and Swedish Ericsson’s rich metadata will power content discovery on DNA’s 4K-enabled Android TV... Read More

SJSemi and Qualcomm Jointly Announce Qualification of 10nm Ultra-high Density Wafer Bumping Technology

www.qualcomm.com September 18, 2017 Comments Off

SJ Semiconductor Corp. (SJSemi) and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, jointly announced that SJSemi has started the qualification of 10nm Ultra-high Density wafer bumping for Qualcomm Technologies.... Read More

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CPT and imec / Holst Centre Demonstrate 1250 ppi, FMM-free Multicolor OLED Displays with Photolithography

Finnish mobile device for detecting arrhythmia soon available for consumers

Leading-Edge Paves the Way For Pure-Play Foundry Growth

Europe’s largest innovation platform STARTUP AUTOBAHN launches its third 100-day program in Stuttgart

ams further expands Singapore manufacturing capacity to address global demand for optical sensor solutions

CPI Appoints Jennie Younger as New Non-Executive Chairman

BAE Systems awards multimillion euro contract to Konstrukta-Defence,a.s in Slovak Republic

Renesas Electronics and Cogent Embedded Collaborate to Make 3D Surround View Parking Assist System Standard in All New Cars

DNA Finland chooses Ericsson for metadata

SJSemi and Qualcomm Jointly Announce Qualification of 10nm Ultra-high Density Wafer Bumping Technology

Flying electric vessel maker Candela raises €30M amid soaring oil prices

Sports-Tech Startup Marquee Raises $1.2 Million to Help Clubs Avoid Billions Lost on Failed Player Transfers

Mouser Electronics Announces Partnership with DS PENSKE for Formula E Season 10, Kicking off in Mexico City

BMW announces new long-term partnership with the Städel Museum. Artist Marc Brandenburg has created an exclusive design for a BMW iX1.

BMW Exploro bikes: new special edition combines innovative technology with progressive design.

60W DOE Level VII ready IP42-sealed wall-mount adapters for medical, home healthcare, and industrial applications

Microsemi Introduces XMC Form Factor SATA SSD for Industrial and Defense Applications

Mouser Electronics’ Robotics Innovation Video Wins Telly Award

Mouser-Sponsored Rebellion Racing Team Looks to Collect a Win at Famed Nürburgring

New Honeywell proximity sensors are rugged and reliable in extreme environments – now from TTI, Inc.