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TowerJazz and Yuanchen Microelectronics Announce Partnership for Backside Illumination (BSI) Manufacturing in Changchun, China

October 30, 2017 Comments Off on TowerJazz and Yuanchen Microelectronics Announce Partnership for Backside Illumination (BSI) Manufacturing in Changchun, China

Partnership enables TowerJazz to offer state of the art BSI flow in mass production for CMOS image sensor high-end markets MIGDAL HAEMEK, Israel and CHANGCHUN, China, October 30, 2017— TowerJazz the global... Read More

SmarTone, Ericsson trial FDD Massive MIMO

October 30, 2017 Comments Off on SmarTone, Ericsson trial FDD Massive MIMO

Ericsson (NASDAQ: ERIC) and SmarTone, the leading mobile network operator in Hong Kong are trialing FDD (Frequency Division Duplex) Massive MIMO (Multiple Input, Multiple Output) technology as part of the... Read More

Blazing-Fast Gaming with Intel’s First Client Optane SSD

October 30, 2017 Comments Off on Blazing-Fast Gaming with Intel’s First Client Optane SSD

Intel today announced the launch of the Intel® Optane™ SSD 900P Series, the first SSD for desktop PC and workstation users built on Intel® Optane™ technology. Intel, in collaboration with... Read More

Mercedes-Benz on automated test drive in the Shanghai megalopolis

https://media.daimler.com October 27, 2017 Comments Off on Mercedes-Benz on automated test drive in the Shanghai megalopolis

Stuttgart/Shanghai. Pedestrian crossings on the motorway, separate speed limits for each lane, traffic signs with Chinese characters – traffic in China differs from that in Europe or the USA in... Read More

UltraSoC appoints Alberto Sangiovanni-Vincentelli as Chairman

October 26, 2017 Comments Off on UltraSoC appoints Alberto Sangiovanni-Vincentelli as Chairman

UltraSoC today announced that Professor Alberto Sangiovanni-Vincentelli has joined the company as Non-Executive Chairman, bringing the benefits of his significant experience in the electronics design industry. The appointment comes as... Read More

NXP Introduces Industry’s First Automotive-Qualified Bluetooth 5-Ready Wireless Microcontrollers with integrated CAN-FD

October 26, 2017 Comments Off on NXP Introduces Industry’s First Automotive-Qualified Bluetooth 5-Ready Wireless Microcontrollers with integrated CAN-FD

SANTA CLARA, California, (ARM TECHCON 2017) – October 24, 2017 – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced its Kinetis KW35/36 MCU family, the industry’s first automotive-qualified Bluetooth 5-ready wireless... Read More