Siemens was awarded top honors for its idea management program at the German congress of the Zentrum Ideenmanagement (“Idea Management Center”), which took place in Fulda over the last two... Read More
BrainChip to be showcased at London Security and Counter Terrorism Exposition
BrainChip Holdings Ltd. (“BrainChip” or the “Company”) (ASX: BRN), a leading developer of software and hardware accelerated solutions for advanced artificial intelligence (AI) and machine learning applications, will be exhibiting... Read More
KEMET Introduces KONNEKT Technology Enabling Higher Power Densities in Smaller Form Factors
KEMET, a leading global supplier of electronic components, today announced new patented KONNEKT technology enabling high power density by combining multiple components into a single surface mountable package. This technology is designed... Read More
Ficosa wins five important contracts for battery management systems for the Chinese market
Ficosa, a top-tier global provider devoted to the research, development, manufacturing and marketing of high-technology vision, safety, connectivity and efficiency systems for the automotive sector, has closed five important contracts... Read More
Imec and Cadence Tape Out Industry’s First 3nm Test Chip
The world-leading research and innovation hub in nanoelectronics and digital technologies, imec, and Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its extensive, long-standing collaboration has resulted in the... Read More
92 IC Wafer Fabs Closed or Repurposed From 2009-2017
Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively... Read More
Jazz selects Ericsson to optimize their complete Radio Network
Ericsson (NASDAQ:ERIC) has signed a contract with Pakistan Mobile Communications Ltd (Jazz) in Pakistan for the optimization and performance management of its complete Radio Network. Coupled with Ericsson’s innovative expertise... Read More
Partnership agreed between Bosch and Munich Re
In the future, the supplier of technology and services Bosch and the reinsurance company Munich Re will be collaborating to develop new ideas in the field of Industry 4.0. On... Read More
Rohde & Schwarz to present world’s first signaling test solution for Bluetooth® LE
Bluetooth Low Energy (LE) has emerged as a major transmission technology for the Internet of Things (IoT). Bluetooth LE components are found in a variety of applications in the automotive... Read More
S3 Semiconductors joins Arm Approved design partner program
S3 Semiconductors, a global supplier of Mixed-Signal and RF Application Specific Integrated Circuit (ASIC) solutions, is pleased to announce that they have joined the Arm® Approved design partner program. This... Read More
























