S3 Semiconductors joins Arm Approved design partner program

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S3 Semiconductors, a global supplier of Mixed-Signal and RF Application Specific Integrated Circuit (ASIC) solutions, is pleased to announce that they have joined the Arm® Approved design partner program. This... Read More

Qualcomm Introduces New Snapdragon 700 Mobile Platform Series

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Qualcomm Incorporated (NASDAQ:QCOM) announced that its subsidiary, Qualcomm Technologies, Inc., has introduced the new Qualcomm® Snapdragon™ 700 Mobile Platform Series, designed to exceed what is expected from today’s high-tier mobile experiences,... Read More

element14 Community Launches ‘Bluetooth Unleashed’ Design Challenge

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element14.com, the community for engineers, has launched a new Design Challenge called “Bluetooth Unleashed.” This latest challenge encourages designers and engineers to uniquely showcase the power of Bluetooth technology by... Read More

NXP Ushers in New Era of eSIM-enabled Devices for 5G and IoT With Industry’s First Single NFC and Secure Element Monolithic Chip

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Company’s eSIM family includes the SN100U, the world’s most integrated “all-in-one” chipset featuring NFC, Secure Element, and eSIM and the SU070 a 40nm Secure element, offering mobile wallet security and... Read More

Ericsson at MWC 2018: 5G open for business

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Ericsson President and CEO Börje Ekholm declared 5G open for business during a briefing to media and analysts on Monday, February 26. There he highlighted the company’s concrete focus on... Read More