All newly registered cars and light trucks in the European Union must be equipped with the eCall automatic emergency system.…
The new 256GB eUFS 2.1 for automotives is the industry’s first storage device to incorporate advanced features of the UFS…
Wafer capacity growth of 8% forecast for 2018 and 2019 versus 4.8% average yearly growth from 2012-2017. IC industry wafer…
TUALATIN, Ore. — February 6, 2018 — CUI’s Interconnect Group today announced the addition of USB Type C connectors to its USB…
TI's new operational amplifier and comparators reduce overall system footprint in IoT, personal electronics and industrial applications DALLAS, Feb. 6,…
The R&S CMW270 wireless connectivity tester is the world’s first tester to emulate all IEEE 802.11a/b/g/n/ac standards, including 802.11ax. In…
KEMET, a leading global supplier of electronic components, today announced a new family of automotive grade metallized polypropylene film capacitors. F863 class X2 miniature…
Toshiba Electronics Europe has started to ship two new 100V additions to its low-voltage U-MOS IX-H N-channel power MOSFET series.…
X-FAB Silicon Foundries SE today announced that it is the first semiconductor foundry whose manufacturing sites are certified for automotive manufacturing…
Anritsu Corporation, a global provider of innovative test and measurement solutions for advanced and converged networks, is pleased to announce…