Components

KEMET Announces New Automotive Grade Film Capacitors for Use in the Most Challenging Environments

KEMET, a leading global supplier of electronic components, today announced a new family of automotive grade metallized polypropylene film capacitors. F863 class X2 miniature capacitors are specifically designed to provide robust performance in safety applications in harsh environments and severe ambient conditions.

These new devices address applications in both the automotive and industrial segments. They provide across-the-line EMI and RFI filtering for the growing number of vehicle electronics applications, as well as in mains-connected indoor applications such as capacitive power supplies.

The F863 series meets AEC-Q200 qualification requirements and is available in capacitance values ranging from 0.1 microfarads to 10 microfarads with rated voltages up to 310 VAC. The new, fully approved RFI X2 capacitors have an operating temperature range of -40 to +110 degrees Celsius.

The metallized polypropylene film dielectric exhibits excellent self-healing characteristics. Additionally, KEMET’s designers have enhanced the major components of this capacitor series to help resist traditional capacitance-loss mechanisms. With these improvements, the F863 series offers very high capacitance stability while meeting ENEC, CUL and CQC international safety requirements.

“The number and severity of challenging electrical and environmental applications is rising,” said Fabio Scagliarini, KEMET Vice President of Film Development. “The demand for complex vehicle electronics is increasing, and customers expect sensitive electronics products to work safely and reliably in high temperature, high humidity situations. Devices from KEMET’s F863 series can provide our customers a robust, dependable solution in these scenarios and comply with the prevailing industry standards.”

Lihi

Recent Posts

Renesas Unveils Industry’s First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers

Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…

17 hours ago

Leica Microsystems launches AI software module for consistent inspection decisions

Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…

17 hours ago

Teradyne Introduces Near-DUT Test Platform for LPDDR6, DDR6 and GDDR7

The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…

17 hours ago

ARX Robotics and DEUTZ Deliver First Ulm-Built GEREON UGVs to Ukraine

The first unmanned ground systems left the production line only 12 weeks after the two…

17 hours ago

AMD Releases Ross Agentic Assistant for Vivado and Vitis HLS Workflows

The available-now engineering assistant connects language models to AMD development tools, documentation and reusable FPGA…

17 hours ago

Murata Begins Mass Production of 0201-Inch Three-Terminal Low-ESL MLCCs

The 0.6 × 0.3 mm capacitors occupy 64% less mounting area than Murata’s previous smallest…

18 hours ago