PHASA-35, a 35m wingspan solar-electric aircraft, has successfully completed its maiden flight. The landmark flight paves the way to this…
No minimum load required Isolation voltages of up to 6000V Rugged, reliable and standards-compliant Broad range of devices to meet…
Backing new touch user interface technology for mobile device, home appliance, automotive, industrial, and medical applications. UltraSense’s 3D ultrasound technology…
Microchip’s PIC18-Q43 family combines more Core Independent Peripherals and an extensive development tool ecosystem for improved designs in real-time control…
Irvine — February 7, 2010— Toshiba America Electronic Components, Inc. (Toshiba) has launched “TC78H670FTG,” the latest addition to its line-up…
Seven major semiconductor acquisition agreements valued at $1 billion or more increase the total value of all deals by 22%…
The fingernail-size Intel chip with Foveros technology is a first-of-its kind. With Foveros, processors are built in a totally new way:…
Espoo, Finland – Nokia today announced that it will extend its long-standing partnership with French mobile operator, IIiad Group, to…
The Global Certification Forum GCF and PTCRB certification organization have accepted first test case validations in various FR1 and LTE…
Combines high-resolution, contactless vibration sensors with built-in data processing for a wide range of Industrial IoT monitoring applications YOKNE’AM ILIT,…