“UltraSense’s technology is of strong strategic relevance and can strengthen Bosch’s leadership in various sensing applications” says RBVC Managing Director Dr. Ingo Ramesohl. “Their solution creates new touch interface opportunities for multiple Bosch products like power tools, home appliances, or in automobiles.” The Series B funding round was led by Artiman Venture Capital and RBVC. Other investors include Sony Innovation Fund, Abies Ventures, Asahi Kasei Corporation, and Hui Capital.
Innovative technology for the future of human machine interfaces (HMI)
UltraSense’s broad product line addresses mobile devices such as smartphones, consumer/IoT, automotive and industrial user interface requirements. The high-end smartphone market alone opens an opportunity for UltraSense of more than 1 billion sensors a year according to statista . The TouchPoint family of sensors is the world’s smallest ultrasound system-on-a-chip delivering touch sensing from thin to thick surfaces through any material including metal, glass, wood, ceramic, or plastic. “With a number of the top mobile OEMs in active evaluations and deployment of our technology, we expect to see products in the market later this year,” says Mo Maghsoudnia, founder and CEO, UltraSense Systems. “This funding will enable faster execution and growth in addition to providing a better support for our strategic customers in the United States and greater Asia.” The sensors come in tiny package sizes and are designed to operate independent of a product’s host processor with all the algorithm processing embedded in the sensor. It can be used as a standalone power button by powering-on the entire product with a simple touch or can be a multi-functional user interface using a series of taps, holds and swipes.
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