Mistral today announced that it has raised €3 billion in a Series D funding round at a post-money valuation of…
RFHIC today launched DiaFlux™, a family of thermal-grade polycrystalline CVD diamond heat spreaders for high-power RF, microwave, optoelectronic, and semiconductor…
The UK fabless chipmaker intends to recruit 20 specialist engineers over the next six months, adding European design capacity for…
The cumulative figure includes tool certification, R&D and selected Intel 18A production layers. Intel says overlay, throughput and availability meet…
Vector is introducing vSECC.InPlug, a new communication controller board for DC charging infrastructures. By relocating charging communication directly into the…
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the TDA235E5 and TDA235E0, a dual-phase smart power stage family designed…
The Series C values Lyte at $1.6 billion as the company moves its multimodal LyteVision platform into production deployments across…
The smartwatch combines a low-power NFC payment chip with a tokenized wallet supporting Mastercard and Visa services, marking the first…
First wafers are scheduled to ship in September, moving the companies’ manufacturing agreement from development towards sampling—but qualification and volume-production…
The Norwegian company’s SBM140B combines a claimed 84 dBA signal-to-noise ratio with a 146 dB SPL overload point and 24-bit…