RFHIC today launched DiaFlux™, a family of thermal-grade polycrystalline CVD diamond heat spreaders for high-power RF, microwave, optoelectronic, and semiconductor packaging applications. The DiaFlux™ product pages, including full specifications for both grades, are now live on RFHIC’s website. [https://rfhic.com/products-diamond-materials/]
Modern high-power designs concentrate ever-greater heat flux beneath small, high-power die. When conventional heat-spreader materials become the bottleneck, the design’s thermal ceiling caps output power, density, and performance. DiaFlux™ brings the highest-thermal-conductivity material class in engineering practice directly to the point of heat generation — in the sizes, thicknesses, and tolerances real packages need.
The family launches with two grades sharing one form-factor system:
Key specifications (both grades):
Because both grades share identical form factors, thickness, tolerances, and surface finish, grade selection is purely a thermal-performance decision — switching grades does not change the mechanical design.
Getting started
Engineers evaluating a thermal design can request a technical consultation with RFHIC’s application engineering team through the DiaFlux™ product pages. To learn more, please contact us.
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