Beyond Copper: Why Integrated Photonics Is Key to Scaling AI Infrastructure

4 days ago
Liat

The collaboration between Tower Semiconductor and Scintil Photonics offers a clear view into the future of data center connectivity in…

Engineering AI: Why Physical AI Is Becoming an Industrial Foundation

4 days ago

How virtual twins, accelerated computing and physics-based models are turning AI from smart software into a reliable engineering infrastructure For…

Cellular from Space: The RF Challenge Behind Direct-to-Device Connectivity

4 days ago

For decades, cellular communication has relied on one almost unquestioned assumption: the base station is on the ground. Antennas mounted…

IBM Quantum Computer Accurately Simulates Real Magnetic Materials, Reproducing National Laboratory Data

4 days ago

IBM (NYSE: IBM) today announced new results that its quantum computer can simulate real magnetic materials with results that match neutron…

Arrow Electronics Announces New Single Pair Ethernet Reference Design Featuring Bourns, Microchip and Amphenol Technology

4 days ago

Arrow Electronics has announced the launch of a new evaluation platform, jointly designed in collaboration with Microchip Technology, Bourns, and…

Siemens introduces AI-powered on-premises analytics for industrial drivetrain systems

5 days ago

Siemens has unveiled Drivetrain Analyzer Onsite, a new on-premises analytics solution for industrial drive systems, at Hannover Messe 2026. The…

Menlo Micro Achieves Key Milestone in U.S. Navy Advanced Circuit Breaker Program, Validating Scalable MEMS Power Switching Leadership

7 days ago

Menlo Microsystems, Inc. (Menlo Micro), a leader in high-performance switches, today announced the successful completion of Task 4 of the…

Wireless modules for embedded systems now available from Tria Technologies

7 days ago

Multi-protocol modules support WiFi®, Bluetooth® and mesh networking standards Tria Technologies™, an Avnet company specializing in embedded compute boards, systems…

Tower Semiconductor and Coherent Demonstrate 400Gbps/lane Data Transmission with a Silicon Modulator in a Production-Ready Sipho Process

7 days ago

 The demonstration uses a silicon MZM without use of exotic materials targeting next-generation 3.2T optical transceivers Tower Semiconductor (NASDAQ/TASE: TSEM),…

Power Integrations Extends Flyback Topology to Enable 440 W, Offering Simpler Alternatives to Resonant Power Designs

7 days ago

New TOPSwitchGaN ICs more than double power output, reducing system cost, complexity, and design time Power Integrations (NASDAQ: POWI), the…