Infineon and Eaton leverage silicon carbide technology to advance solid-state transformers for 800 VDC AI data center power architectures

• Infineon and Eaton are partnering to drive solid-state transformer (SST) technology 
• The collaboration addresses demand for more efficient power conversion solutions in AI data centers 
• Infineon’s silicon carbide power devices help enhance efficiency, power density and system reliability of Eaton’s SST platform

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will deliver silicon carbide (SiC) power devices to Eaton, an intelligent power management company, for use in its medium-voltage solid-state transformer (MVSST) 2.0 platform designed for deployment across APAC and EMEA markets. The collaboration helps increase the efficiency and reliability of the power conversion required to connect AI data centers to the electricity grid. It targets 800 Volts direct current (VDC) data center power distribution architectures.

The rapid expansion of AI data centers and rising power requirements are driving demand for more efficient ways to connect high-density computing infrastructure to the grid. At the same time, advances in medium-voltage DC distribution technologies are accelerating the need for next-generation power conversion solutions that can improve efficiency, power density, scalability and reliability.

“As energy demand from AI data centers and industrial applications continues to grow, the demand for efficient, reliable and sustainable power conversion is increasing,” said Andreas Weisl, Executive Vice President and Chief Sales Officer of Industrial & Infrastructure at Infineon. “By joining forces with Eaton, we aim to advance solid-state transformer technology and contribute to the development of a more scalable, efficient and sustainable infrastructure for powering the AI data centers of the future.”

“Against the backdrop of rapidly increasing requirements for power efficiency, system reliability and scalability in AI data centers, our goal is to advance the development and adoption of SST technology. Thus, we aim to create greater value for data center and power grid operators as well as the renewable energy sector,” said David Zheng, Vice President of R&D for Power Quality in APAC at Eaton. “Infineon’s advanced SiC technology is helping us accelerate the deployment of these next-generation power architectures.”

Designed for high-density computing infrastructures and emerging 800 VDC AI data center power distribution architectures, Eaton’s MVSST 2.0 platform reduces conversion stages compared with conventional architectures, improving efficiency, power density and deployment flexibility. As one of the first medium-voltage solid-state transformer platforms to achieve IEC certification, it combines advanced silicon carbide technology with Eaton’s expertise in power distribution and conversion to support next-generation energy infrastructure.

Looking ahead, Eaton and Infineon are exploring next-generation SST platforms based on 2.3 kV and 3.3 kV SiC power modules to support higher system voltages, greater efficiency and enhanced reliability for future AI data centers, grid modernization and renewable energy applications.