Now available through Powell are Samtec’s 0.635 mm pitch AcceleRate® mP series connectors for High-Density, High-Speed Systems

In stock at Powell Electronics, the supplier of connectors and more for high-rel applications including defence, aerospace and industrial, is the 0.635 mm pitch AcceleRate® mP connector series, a next-generation family of high-density, high-speed power and signal arrays designed for the increasingly demanding requirements of AI, HPC, and advanced datacom applications.

Engineered for exceptional density and performance, the AcceleRate mP series features a compact, low-profile architecture with standard 5 mm and 10 mm stack heights. The connectors support up to 64 Gbps PAM4 (32 Gbps NRZ) and are fully capable of meeting PCIe® 6.0 and CXL™ 3.1 requirements.

A defining characteristic of the new series is the use of rotated power blades, which significantly improve thermal behavior while simplifying the breakout region. The open-pin-field layout further enhances routing and grounding flexibility, making the system ideal for dense, high-performance design environments. Configurations include up to eight power and 240 signal positions.

Each connector incorporates weld tabs for secure board-level attachment, along with polarized guide posts to ensure reliable blind mating. Optional alignment pins are also available for applications requiring additional mating accuracy.

“The AcceleRate mP series represents a major step forward in high-density interconnect design,” comments Gary Evans, European Director at Powell Electronics. “As next-generation compute and networking architectures push the limits of power, speed, and space, this platform provides the performance and flexibility engineers need to move confidently into the next era of system design.”

For further information about Powell in Europe please visit: www.powell-europe.com

For project design or procurement support please contact: Europe@powell.com

Credit: Powell Electronics