New BGAP520 PCIe NVMe product family addresses need for soldered-down and small module form factor Flash storage for industrial embedded market segments
NEWARK, Calif., December 14, 2020 —SMART Modular Technologies, a subsidiary of SMART Global Holdings, Inc., (NASDAQ: SGH), and a leader in specialty memory, storage and hybrid solutions including DRAM memory modules, solid state drives (SSDs) and other Flash memory products, introduces a new line of PCIe NVMe solid state drive (SSD) Flash products designed for industrial embedded applications. The new BGAP520 PCIe NVMe family of products in M.2 Type 1620 BGA package (BGA NVMe) and small form-factor M.2 2230 single-sided module is ideal in embedded systems where space constraints are a key design consideration.
BGAP520 PCIe NVMe is the latest addition to SMART Modular’s portfolio of DuraFlash™ products to deliver durable and reliable Flash solutions to the industrial embedded market segment. DuraFlash-branded products are built to high standards to withstand the harshest operating environments including extreme hot and cold temperatures, vibration, humidity, salty air, dust and exposure to sulfur dioxide.
SMART’s new Type 1620 BGA NVMe and M.2 2230 PCIe NVMe modules address the need for soldered down and small form factor Flash storage in embedded systems. The products utilize a PCIe Gen 3 x4 interface and comply with the NVM Express v1.3 protocol standard. They are available in 3D NAND tri-level cell (TLC) in commercial temperature (0 °C to 70 °C) in 30GB to 240GB and pseudo single-level cell (pSLC) industrial temperature (-40 °C to 85 °C) in 20GB to 80GB versions.
Features for the SMART BGAP520 BGA NVMe and M.2 2230 products include:
- Built with the latest controller and 3D NAND technology
- Supports PCIe Gen3 x 4
- Complies with NVMe v1.3 specifications
- BGA NVMe conforms to M.2 Type 1620 BGA package standard
- 2 2230 module conforms to M.2 2230 S2-M module standard
- TLC version available in commercial temperature (0 °C to 70 °C) from 30GB to 240GB
- pSLC version available in industrial temperature (-40 °C to 85 °C) from 20GB to 80GB
“At SMART, we’ve developed state-of-the-art solutions for businesses that embed memory and storage into their technology,” said Victor Tsai, director of Flash Products, SMART Modular. “With the BGAP520 PCIe NVMe products in Type 1620 BGA package and M.2 2230 module, designers can count on robust and ruggedized Flash memory solutions with unrivalled performance. We are very excited to offer these new products to our customers to incorporate into their connected IIoT devices.”
