Connectors & Cables

Harwin Provides Industry with Smallest & Most Lightweight Mixed-Layout Connectors To Date

Featuring cable, vertical & right-angle PCB versions that all support 10A current delivery

Harwin continues to extend the scope of its high-reliability (hi-rel) connector portfolio through the introduction of mixed-layout versions of the company’s popular Gecko-SL series. By complementing the data contacts with 2 or 4 power contacts (in power/data configurations of either 1+8+1 or 2+8+2), the Gecko-MT products enable significant space and weight reductions in electronic hardware. This means that they address modern system designs where major constraints can be placed on these parameters. The respective power and data current ratings are 10A and 2.8A max per contact.

The initial release comprises female and male cable connectors, plus female vertical and male right-angle PCB connector options. These components are fitted with sturdy, stainless steel screw-lok fixings (in both conventional and reversed formats), to ensure ongoing interconnect integrity in even the most challenging of application environments. They have 20G vibration and 100G shock resilience and their operational temperature range spans from -65°C to 150°C. Low outgassing properties are also exhibited.

By encompassing both data and power in a single compact and lightweight solution, Gecko-MT connectors are highly optimised for avionics, defence, space, and motorsport. Among the key target applications are robotics, unmanned aerial vehicles (UAVs), battery management and satellites. They are available from stock and through Harwin’s distribution network. In addition, cable assemblies can be requested for manufacture by Harwin’s in-house operations.

“By specifying Gecko-MT, engineers will be able to streamline their designs, improve size and weight profiles and reduce bill-of-materials costs by using a smaller and lower-cost component than comparable Micro-D connectors,” states John Brunt, Product Manager for High-Reliability at Harwin. “By combining together power and signal in one robust mating pair, savings can be made in both weight and space, without any compromise in performance or longevity.”


SIVAN

Recent Posts

NewPhotonics® and Tower Semiconductor Begin High-Volume Shipments of Laser-Integrated, Serviceable Optical Engine PICs for Scale-Out and Scale Up AI Interconnect

Companies commercialize scale manufacturability of 800G to 1.6T PICs in external pluggable and CPX MSA…

8 hours ago

Samtec 1.0 mm Connectors Capable of DC to 120 GHz

Samtec, Inc., the service leader in the connector industry, announces the release of its 1.0…

1 day ago

LaFontaine Automotive Group Partners with UVeye to Offer Complimentary AI Vehicle Safety Scans Across Michigan

LaFontaine’s 40+ locations across Michigan will bring UVeye’s “MRI for Cars” technology closer to drivers…

2 days ago

Startup ChikChak Market Launches Israel’s first Reels-Based Marketplace for Secondhand Goods

After 3 years of development by alumni of TikTok and Google, the Israeli startup is…

2 days ago

Analog Devices to Acquire Alif Semiconductor for $1.35 Billion, Expanding Its Edge AI Platform

The planned acquisition will combine Analog Devices’ sensing, signal-processing, power and connectivity technologies with Alif’s…

4 days ago

Kyocera and Tohoku University Integrate Optical Isolator Directly on Silicon Photonics

A locally applied laser-annealing process enabled the researchers to crystallise magneto-optical garnet without exposing the…

4 days ago