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NXP Introduces New High Power RF Products for 5G Networks

 (IMS 2018) – Semiconductors N.V. (NASDAQ:NXPI) is driving innovation with its expanded cellular infrastructure portfolio of GaN and silicon laterally diffused metal oxide semiconductor (Si-LDMOS) products that deliver industry leading performance in a compact footprint to enable next-generation 5G cellular networks.

Spectrum expansion, higher order modulation, carrier aggregation, full dimension beam forming, and other enablers of 5G connectivity will require an expanded base of technologies to support enhanced mobile broadband connectivity. With spectrum usage and network footprints, multiple-input, multiple output (MIMO) technologies from four transmit (4TX) antennas to 64 TX and higher will be employed. The future of 5G networks will depend on GaN and Si-LDMOS technologies and NXP is at the forefront in its RF power amplifier development.

“Building on the success of 25 years of LDMOS leadership — NXP released the world’s first LDMOS product in 1992 — today, we are extending our RF leadership with industry leading GaN technology, developed with the highest linear efficiency for cellular applications,” said Paul Hart, senior vice president and general manager of NXP’s RF Power business. “Backed with the best supply chain, global applications support and unparalleled design expertise in the industry, NXP is positioned to be the leading RF partner for 5G solutions.”

At IMS 2018, NXP is introducing new RF GaN wideband power transistors and expanding its Airfast third-generation Si-LDMOS portfolio of macro and outdoor small cell solutions.

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NXP Semiconductors is driving innovation with expanded cellular infrastructure portfolio of GaN and silicon laterally diffused metal oxide semiconductor (Si-LDMOS) products that deliver industry leading performance in a compact footprint to enable next-generation 5G cellular networks.

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