Components

STMicroelectronics’ Single-Chip Balun for sub-1GHz Radio Practically Makes Antenna-Matching/Filtering Circuitry Disappear

STMicroelectronics has introduced a matched balun for its S2-LP 868-927MHz low-power radio transceiver to help engineers save board space and minimize RF-circuit design challenges in size- and cost-conscious products like IoT sensors, smart meters, alarms, remotes, building automation, and industrial controls.

The 3.26mm2 BALF-SPI2-01D3 integrates all the impedance-matching and filtering components needed to connect an antenna to the S2-LP radio, replacing a conventional network of 16 discrete capacitors and inductors that can occupy up to 100mm2 of board real-estate — a footprint reduction of more than 96%.

In addition to saving space, circuit design is greatly simplified, with no need to select component values or tackle exacting layout challenges. Fully optimized for the S2-LP, the balun comes with placement and connection recommendations that are tested and verified and can be directly replicated to maximize RF performance.

The BALF-SPI2-01D3 is the latest in ST’s family of integrated baluns. There are now 16 devices, in package sizes down to 0.8mm2 and just 0.56mm high after reflow, for use with ST’s sub-1GHz or Bluetooth® low energy 2.4GHz radios, as well as with various transceivers from other manufacturers.

As a critical enabling technology for these highly integrated matching devices, ST’s Integrated Passive Device (IPD) on non-conductive glass-substrate ensures low RF signal losses, with low amplitude and phase imbalances, ultimately resulting in superior RF-subsystem performance and longer operating life for battery-powered devices. With the increasing importance of connected, smart objects to support consumer lifestyles and to enhance business efficiency and innovation of new services in commercial, energy, and industrial sectors, designers can gain a competitive edge in these fast-growing markets by using ST’s integrated baluns to trim product dimensions, maximize performance, and shorten development cycles.

The BALF-SPI2-01D3 is in production now, in a 6-bump 2.1mm x 1.55mm chip-scale package, priced from $0.176 for orders of 500 units.

For further information please visit www.st.com/balf-spi2-01d3-news

Liat

Recent Posts

Molex Completes Acquisition of Teramount Ltd.

Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd.,…

16 hours ago

Immunai Expands Oncology Collaboration, Extending AI-Driven Biomarker and Clinical Insights Through 2027

This agreement marks the third expansion of its collaboration with AstraZeneca, building on collaborations in…

16 hours ago

Cleveland Clinic, RIKEN, and IBM Model a 12,635-Atom Protein – the Largest Known to Be Simulated with Quantum Computers

Milestone simulation of biologically meaningful molecules expands quantum-centric supercomputing’s role as a scientific tool Scientists…

4 days ago

Never lose the signal: the Israeli company redefining military communications

Commcrete develops compact satellite communication devices that maintain secure connectivity during combat, rescue, and electronic…

4 days ago

Yaron Elad and Elik Etzion Launch AlphaDrive, a $100 Million Fund Focusing on Cyber and AI Investments

Leumi Partners has joined the fund as an anchor investor. The fund has already invested…

6 days ago

60W DOE Level VII ready IP42-sealed wall-mount adapters for medical, home healthcare, and industrial applications

XP Power introduces the AMF60 series of 60W wall-mount AC-DC power supplies for medical, home…

2 weeks ago