Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.
“Teramount’s passive, detachable coupling approach supports large assembly tolerances and semiconductor‑grade wafer‑level processes—filling a critical gap in the optical stack,” said Aldo Lopez, president, Datacom Solutions, Molex. “By integrating this unique technology into our optical interconnect portfolio, Molex offers a more seamless path from early-stage prototypes to high-volume CPO and other silicon photonics architectures required for the AI era.”
Teramount will continue to operate as a design and engineering hub in Jerusalem, supported by Molex’s global optical capabilities. It will become part of the Optical Connectivity segment within the Optical Solutions Business at Molex.
Financial terms of the transaction were not disclosed.
First large-scale inference cluster with Together AI on IBM Cloud using NVIDIA HGX B300 systems to help…
The 24-month program will develop real-time process monitoring capabilities for the F3300 and F900 industrial…
OpenLight’s PDK is now available on Cadence’s EDA tools, enabling PIC development on Tower’s PH18DA…
Under the agreement, Ashtrom Industries will evaluate the material's performance and its potential integration into…
LASER COMPONENTS has expanded its offering of custom thin-film polarizers (TFPs) for high-power laser applications…