Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.
“Teramount’s passive, detachable coupling approach supports large assembly tolerances and semiconductor‑grade wafer‑level processes—filling a critical gap in the optical stack,” said Aldo Lopez, president, Datacom Solutions, Molex. “By integrating this unique technology into our optical interconnect portfolio, Molex offers a more seamless path from early-stage prototypes to high-volume CPO and other silicon photonics architectures required for the AI era.”
Teramount will continue to operate as a design and engineering hub in Jerusalem, supported by Molex’s global optical capabilities. It will become part of the Optical Connectivity segment within the Optical Solutions Business at Molex.
Financial terms of the transaction were not disclosed.
Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…
Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…
The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…
The first unmanned ground systems left the production line only 12 weeks after the two…
The available-now engineering assistant connects language models to AMD development tools, documentation and reusable FPGA…
The 0.6 × 0.3 mm capacitors occupy 64% less mounting area than Murata’s previous smallest…