The new CoolMOS P7 is designed to address needs of the low power SMPS market. It offers excellent performance and ease-of-use, allowing designers to take advantage of improved form factors. It uses a price competitive Superjunction technology, which results in a reduced overall Bill of Materials (BOM) on the customer side.
The SOT-223 package is a cost-effective DPAK alternative and well established in price sensitive markets. The thermal behavior of the CoolMOS P7 in this package was assessed across several applications. When the SOT-223 was placed on a DPAK footprint, the temperature increased by a maximum of 2-3°C compared to a standard DPAK. With a size of the copper area of 20 mm² or more, the thermal performance was equal to DPAK.
Availability
The CoolMOS P7 in SOT-223 is available in 600 V, 700 V, and 800 V devices. Additional R DS(on) versions of the 700 V and 800 V devices will be launched soon. More information is available at www.infineon.com/p7 and www.infineon.com/sot-223