Components

Toshiba Adds 60V and 100V Products to High Current Photorelays with S-VSON4, the Industry’s Smallest Packag

TOKYO–Toshiba Corporation’s (TOKYO: 6502) Storage & Electronic Devices Solutions Company today announced the launch of new two high current products, the 60V “TLP3407S” and the 100V “TLP3409S”, additions to its line-up of photorelays packaged in S-VSON4[1], the package with the industry’s smallest mounting area[2]. Mass production shipments start today.

The new products realize high voltages while retaining the features of TLP3406S, already in the line-up, which offers a 30V voltage with large on-state current rating and small size. The higher voltages realize support for DPS[3] applications, such as SoC testers, which require voltage variation for automotive ICs.

The S-VSON4 package has a 22.5% smaller mounting area than the current VSON4 package[4]. This series also pushes operating temperature to a new high, from 85°C to 110°C. It contributes to improved design efficiency by reducing the size of the tester board, increasing the number of relay circuits, and further improving integration density.

The latest Gartner market report recognizes Toshiba as the leading manufacturer of optocouplers by sales in 2015 and 2016, with 23% of sale-based market share in CY2016. (Source: Gartner “Market Share: Semiconductor Devices and Applications Worldwide, 2016” 30 March 2016.)

Toshiba will continue to deliver products that meet the needs of customers by promoting the development of a diverse portfolio of photocouplers and photorelays tailored to market trends.

Liat

Recent Posts

Renesas Unveils Industry’s First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers

Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…

23 hours ago

Leica Microsystems launches AI software module for consistent inspection decisions

Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…

23 hours ago

Teradyne Introduces Near-DUT Test Platform for LPDDR6, DDR6 and GDDR7

The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…

23 hours ago

ARX Robotics and DEUTZ Deliver First Ulm-Built GEREON UGVs to Ukraine

The first unmanned ground systems left the production line only 12 weeks after the two…

23 hours ago

AMD Releases Ross Agentic Assistant for Vivado and Vitis HLS Workflows

The available-now engineering assistant connects language models to AMD development tools, documentation and reusable FPGA…

24 hours ago

Murata Begins Mass Production of 0201-Inch Three-Terminal Low-ESL MLCCs

The 0.6 × 0.3 mm capacitors occupy 64% less mounting area than Murata’s previous smallest…

1 day ago