Categories: Test Equipment

Rohde & Schwarz presents the world’s first server-based exciter for ATSC 3.0

Rohde & Schwarz has developed the world’s first IT server-based exciter solution for ATSC 3.0 broadcasts – the R&S SDE900. It provides broadcasters with an easy upgrade path for existing transmitters, such as the R&S THU9 and R&S THU9evo high-power transmitters from Rohde & Schwarz, to ATSC 3.0 and future standards. The R&S ATSC 3.0 solution will be demonstrated in the R&S booth SL1205 at NAB 2017, running from April 22-27 in Las Vegas.

When developing the new ATSC 3.0 broadcast standard, the focus was on IP technologies that could provide broadcast network operators more flexibility in their service offerings. Rohde & Schwarz looked for new ways to implement the standard. The result is the R&S SDE900, a plug-in rack-mount module for the R&S Tx9 generation of energy-efficient transmitters, making it an easy upgrade path to the ATSC 3.0 standard. The R&S SDE900’s software-based encoder generates the I/Q modulation data on its high-performance IT server. The field-proven R&S TCE900/TCE901 exciter from Rohde & Schwarz generates the COFDM waveform based upon the I/Q data.

“The R&S SDE900’s software-based approach ideally prepares network operators for the ATSC 3.0 standard,” said Manfred Reitmeier, Senior Director of R&D Transmitter Systems, Rohde & Schwarz. “This high-performance IT server-based solution enables network operators to flexibly respond to signal processing requirements of the future. And our R&S TCE900 exciter offers the most powerful precorrection on the market with the high level of signal quality expected from Rohde & Schwarz.”

The R&S SDE900 will initially be available for high-power transmitters. These transmitters were part of the world’s first broadcast in the ATSC 3.0 UHD standard when Seoul Broadcasting System in South Korea used the R&S THU9 to broadcast the first sports event in ATSC 3.0 last December.

Liat

Recent Posts

New-Tech Europe | Q3 2026 | Digital Edition

New-Tech Europe | Q3 2026 | Digital Edition

4 days ago

IBM and Together AI Sign Multi-Year Agreement to Scale Open-Source AI Inference with NVIDIA AI Infrastructure on IBM Cloud

First large-scale inference cluster with Together AI on IBM Cloud using NVIDIA HGX B300 systems to help…

4 days ago

Stratasys Secures $7.8M to Advance In-Situ Quality Assurance for Additive Manufacturing

The 24-month program will develop real-time process monitoring capabilities for the F3300 and F900 industrial…

5 days ago

OpenLight and Tower Semiconductor Expand PH18DA Photonics Ecosystem to Accelerate Photonic IC Development

OpenLight’s PDK is now available on Cadence’s EDA tools, enabling PIC development on Tower’s PH18DA…

5 days ago

Starstone and Ashtrom Industries Sign Industrial Cooperation Agreement to Evaluate Innovative Biogenic Cement Technology

Under the agreement, Ashtrom Industries will evaluate the material's performance and its potential integration into…

6 days ago

Thin-Film Polarizers for High-Power Laser Systems

LASER COMPONENTS has expanded its offering of custom thin-film polarizers (TFPs) for high-power laser applications…

7 days ago