Texas Instruments (TI) (NASDAQ: TXN) today introduced a new single-chip reinforced isolator with integrated power that offers 80 percent higher efficiency than existing integrated devices. With the industry’s most efficient power transfer, lowest radiated emissions and highest immunity this new reinforced isolator supports reliable operation of industrial systems, including factory automation, grid infrastructure, motor control, isolated power supplies, and test and measurement equipment.
Compared to discrete solutions, the ISOW7841 integrates both isolated data and power, enabling a smaller bill of materials (BOM) and reduced board space, as well as helping with easier and faster system certification. For more information, see www.ti.com/isow-pr.
Key features and benefits of the ISOW7841
The ISOW7841 reinforced isolator with a three forward/one backward channel configuration is the first device in the ISOW78xx family, with multiple devices expected later in 2017. These new devices join TI’s isolation portfolio that supports the highest isolation ratings, reliability, immunity and performance.
Tools and support to speed design
Designers can quickly and easily evaluate the new reinforced isolator with the ISOW7841 evaluation module (ISOW7841EVM), available today for US$49 from the TI store and authorized distributors. Engineers can also jump-start their system design with the integrated signal and power reference designs for isolated RS-485 and RS-232. Additionally, another reference design is available to help integrate reinforced isolation and power in an industrial grid design.
Package, availability and pricing
The ISOW7841 reinforced isolator with integrated power is now available through the TI store and authorized distributors in a 16-pin small outline integrated circuit (SOIC) wide-body package. This device is available in both fail-safe low and fail-safe high configurations. Pricing starts at US$5.50 in 1,000-unit quantities.
Visit TI at APEC
See the reinforced isolator with integrated power and learn about other ways TI is giving engineers the power to innovate, design and learn by visiting booth No. 701 at the Applied Power Electronics Conference (APEC) in Tampa, Florida, March 27-29, 2017.
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